⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9219442 | 0.87 | — | — | |
| SCHEMBL28220014 | 0.87 | — | — | |
| SCHEMBL28234129 | 0.87 | — | — | |
| SCHEMBL9693566 | 0.87 | — | — | |
| SCHEMBL27557 | 0.82 | — | — | |
| SCHEMBL4305933 | 0.82 | — | — | |
| SCHEMBL2170354 | 0.82 | — | — | |
| SCHEMBL6992465 | 0.82 | — | — | |
| SCHEMBL10720052 | 0.82 | — | — | |
| SCHEMBL6839937 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107675293-A | A kind of anticorrosive ceramic fibre | 浙江科屹耐火材料有限公司 | 2018-02-09 | — | — | CN | claimed |
| CN-106680418-A | Method for detecting content of enhanced material in metal-based carbon composite nano-material | 武汉大学 | 2017-05-17 | — | — | CN | claimed |
| CN-113399662-B | Preparation method of molybdenum-lanthanum alloy sintered blank and product thereof | 中南大学 | 2022-03-18 | — | — | CN | disclosed |
| CN-113399662-A | Preparation method of molybdenum-lanthanum alloy sintered blank and product thereof | 中南大学 | 2021-09-17 | — | — | CN | disclosed |
| EP-3375056-B1 | ALINGAN ALLOY BASED LASER DIODE | TOP GAN SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA (PL) | 2021-07-14 | — | — | EP | disclosed |
| US-10439362-B2 | AlInGaN alloy based laser diode | TOPGAN SP. Z O.O. (PL) | 2019-10-08 | — | — | US | disclosed |
| US-20180331501-A1 | AlInGaN ALLOY BASED LASER DIODE | INSTYTUT WYSOKICH CISNIEN POLSKIEJ AKADEMII NAUK (PL) | 2018-11-15 | — | — | US | disclosed |
| EP-3375056-A1 | ALINGAN ALLOY BASED LASER DIODE | Topgan SP. Z O.O. (PL) | 2018-09-19 | — | — | EP | disclosed |
| CN-107111408-A | The manufacture method of conductive board and conductive board | 住友金属矿山股份有限公司 | 2017-08-29 | — | — | CN | disclosed |
| WO-2017082746-A1 | ALINGAN ALLOY BASED LASER DIODE | TOPGAN SP. Z O.O. (PL) | 2017-05-18 | — | — | WO | disclosed |
| US-20090201038-A1 | TEST HEAD FOR FUNCTIONAL WAFER LEVEL TESTING, SYSTEM AND METHOD THEREFOR | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2009-08-13 | — | — | US | disclosed |
| WO-1997034169-A1 | METHOD FOR ANALYSING DATA IN THE EXPLORATION FOR MINERALS | NEURAL MINING SOLUTIONS PTY. LTD. (AU) | 1997-09-18 | — | — | WO | disclosed |
| EP-0244666-B1 | Balltape structure for tape automated bonding, multilayer packaging and universal chip interconnection | IBM (US) | 1993-12-15 | — | — | EP | disclosed |
| EP-0171662-B1 | METHOD OF FABRICATING A CHIP INTERPOSER | International Business Machines Corporation (US) | 1990-07-11 | — | — | EP | disclosed |
| US-4814855-A | Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1989-03-21 | — | — | US | disclosed |
| EP-0244666-A2 | Balltape structure for tape automated bonding, multilayer packaging and universal chip interconnection | International Business Machines Corporation (US) | 1987-11-11 | — | — | EP | disclosed |
| US-4617730-A | Method of fabricating a chip interposer | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1986-10-21 | — | — | US | disclosed |
| EP-0171662-A2 | Method of fabricating a chip interposer | International Business Machines Corporation (US) | 1986-02-19 | — | — | EP | disclosed |
| EP-0116927-A2 | An interconnection change pad for use on a ceramic substrate receiving integrated circuit chips | International Business Machines Corporation (US) | 1984-08-29 | — | — | EP | disclosed |