SCHEMBL2170354

SCHEMBL2170354

[Au].[Au].[Ni]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28198049 1.00
SCHEMBL4305933 1.00
SCHEMBL30577787 1.00
SCHEMBL145400 1.00
SCHEMBL6839937 1.00
SCHEMBL81562 0.82
SCHEMBL7781802 0.82
SCHEMBL11526650 0.82
SCHEMBL4091020 0.82
SCHEMBL936744 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025095508-A1 BIOHYBRID ROBOT INCLUDING EYE/BRAIN ORGANOID, MOTOR NERVE SPHEROID, AND MUSCLE BUNDLE, AND MANUFACTURING METHOD THEREFOR 서강대학교산학협력단 2025-05-08 WO claimed
CN-108985620-A Change the monitoring method and system of the consumption of nickel gold gold salt 江西旭昇电子有限公司 2018-12-11 CN claimed
US-20060091561-A1 Electronic component comprising external surface contacts and a method for producing the same QIMONDA AG (DE) 2006-05-04 US claimed
EP-1508166-A2 ELECTRONIC COMPONENT COMPRISING EXTERNAL SURFACE CONTACTS AND A METHOD FOR PRODUCING THE SAME Infineon Technologies AG (DE) 2005-02-23 EP claimed
WO-2003103042-A2 ELECTRONIC COMPONENT COMPRISING EXTERNAL SURFACE CONTACTS AND A METHOD FOR PRODUCING THE SAME INFINEON TECHNOLOGIES AG (DE) 2003-12-11 WO claimed
US-20250295034-A1 METHOD OF MANUFACTURING THERMOELECTRIC DEVICES WITH INSULATORS SHEETAK, INC. (US) 2025-09-18 US disclosed
WO-2025095508-A1 BIOHYBRID ROBOT INCLUDING EYE/BRAIN ORGANOID, MOTOR NERVE SPHEROID, AND MUSCLE BUNDLE, AND MANUFACTURING METHOD THEREFOR 서강대학교산학협력단 2025-05-08 WO disclosed
US-20250029752-A1 METHOD AND ELECTRICAL CONTACT ELEMENT ROHDE & SCHWARZ GMBH & CO. KG (DE) 2025-01-23 US disclosed
US-20250031305-A1 METHOD AND ELECTRICAL CONTACT ELEMENT ROHDE & SCHWARZ GMBH & CO. KG (DE) 2025-01-23 US disclosed
CN-117641766-A Method for improving diffusion plating short circuit at connecting position of electric circuit and non-electric circuit 大连崇达电路有限公司 2024-03-01 CN disclosed
CN-108985620-A Change the monitoring method and system of the consumption of nickel gold gold salt 江西旭昇电子有限公司 2018-12-11 CN disclosed
CN-108985620-A Change the monitoring method and system of the consumption of nickel gold gold salt 江西旭昇电子有限公司 2018-12-11 CN disclosed
CN-102255248-B Ion generating device, charging device and image forming apparatus SHARP KK 2012-12-19 CN disclosed
CN-101364711-B Ion generating element, method of manufacturing the same, charging device, and image forming apparatus SHARP KK 2012-09-05 CN disclosed
CN-102255248-A Ion generating device, method for producing ion generating device, charging device, and iamge forming apparatus SHARP KK 2011-11-23 CN disclosed
US-7985285-B2 Gold cyanide salt, complexing agent, aldehyde, amine; plating copper, nickel, palladium base metal part; prevent diffusion of cobalt, prevent oxidation of nickel, improve corrosion resistance of circuits or terminals C. UYEMURA & CO., LTD. (JP) 2011-07-26 US disclosed
CN-101364711-A Ion generating element, method of manufacturing the same, charging device, and image forming apparatus SHARP KK (JP) 2009-02-11 CN disclosed
US-20060091561-A1 Electronic component comprising external surface contacts and a method for producing the same QIMONDA AG (DE) 2006-05-04 US disclosed
EP-1508166-A2 ELECTRONIC COMPONENT COMPRISING EXTERNAL SURFACE CONTACTS AND A METHOD FOR PRODUCING THE SAME Infineon Technologies AG (DE) 2005-02-23 EP disclosed
WO-2003103042-A2 ELECTRONIC COMPONENT COMPRISING EXTERNAL SURFACE CONTACTS AND A METHOD FOR PRODUCING THE SAME INFINEON TECHNOLOGIES AG (DE) 2003-12-11 WO disclosed