Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.67 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.67 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.60 |
| ▸ | TSHR | P16473 | 3/20 | 0.50 |
| ▸ | LMNA | P02545 | 2/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.50 |
| ▸ | MEN1 | O00255 | 1/20 | 0.50 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.50 |
| ▸ | PRKD3 | O94806 | 2/20 | 0.44 |
| ▸ | PRKCG | P05129 | 2/20 | 0.44 |
| ▸ | PRKCB | P05771 | 2/20 | 0.44 |
| ▸ | PRKCA | P17252 | 2/20 | 0.44 |
| ▸ | PRKCH | P24723 | 2/20 | 0.44 |
| ▸ | PRKCI | P41743 | 2/20 | 0.44 |
| ▸ | PRKCE | Q02156 | 2/20 | 0.44 |
| ▸ | PRKCQ | Q04759 | 2/20 | 0.44 |
| ▸ | PRKCZ | Q05513 | 2/20 | 0.44 |
| ▸ | PRKCD | Q05655 | 2/20 | 0.44 |
| ▸ | PRKD1 | Q15139 | 2/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Tridecan-1-Ol SCHEMBL28091190 | 1.00 | ALDH1A1 (0.67) | ALDH1A1TDP1SMN1; SMN2TSHRLMNA | |
| 1,6-Hexanediol SCHEMBL28148444 | 1.00 | ALDH1A1 (0.67) | ALDH1A1TDP1SMN1; SMN2TSHRLMNA | |
| 1-Heptanol SCHEMBL27157060 | 1.00 | ALDH1A1 (0.67) | ALDH1A1TDP1SMN1; SMN2TSHRLMNA | |
| Docosanol SCHEMBL28829294 | 1.00 | ALDH1A1 (0.67) | ALDH1A1TDP1SMN1; SMN2TSHRLMNA | |
| Decanol SCHEMBL10349753 | 1.00 | ALDH1A1 (0.67) | ALDH1A1TDP1SMN1; SMN2TSHRLMNA | |
| Myristyl Alcohol SCHEMBL10349754 | 1.00 | ALDH1A1 (0.67) | ALDH1A1TDP1SMN1; SMN2TSHRLMNA | |
| Myristyl Alcohol SCHEMBL28549927 | 1.00 | ALDH1A1 (0.67) | ALDH1A1TDP1SMN1; SMN2TSHRLMNA | |
| Decanol SCHEMBL10350849 | 1.00 | ALDH1A1 (0.67) | ALDH1A1TDP1SMN1; SMN2TSHRLMNA | |
| Cetostearyl Alcohol SCHEMBL9347369 | 1.00 | ALDH1A1 (0.67) | ALDH1A1TDP1SMN1; SMN2TSHRLMNA | |
| Dodecanol SCHEMBL1300157 | 1.00 | ALDH1A1 (0.67) | ALDH1A1TDP1SMN1; SMN2TSHRLMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 189 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024052276-A1 | CURABLE POLYMER COMPOSITION HAVING IMPROVED WASH-OFF RESISTANCE | ZEPHYROS, INC. (US) | 2024-03-14 | — | — | WO | claimed |
| US-11198754-B2 | Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator | SIKA TECHNOLOGY AG (CH) | 2021-12-14 | — | — | US | claimed |
| US-20190002626-A1 | HEAT-CURING EPOXY RESIN COMPOSITION CONTAINING NON-AROMATIC UREAS AS ACCELERATOR | SIKA TECHNOLOGY AG (CH) | 2019-01-03 | — | — | US | claimed |
| EP-4399254-A1 | EXPANDABLE ONE-COMPONENT THERMOSETTING EPOXY ADHESIVE WITH IMPROVED ADHESION | Sika Technology AG (CH) | 2024-07-17 | — | — | EP | disclosed |
| WO-2024126186-A1 | ONE-COMPONENT CATIONIC POLYMERIZABLE COMPOSITION | HUNTSMAN ADVANCED MATERIALS LICENSING (SWITZERLAND) GMBH (CH) | 2024-06-20 | — | — | WO | disclosed |
| WO-2024113146-A1 | MOISTURE AND HEAT-CURABLE SEALING COMPOSITION | SIKA TECHNOLOGY AG (CH) | 2024-06-06 | — | — | WO | disclosed |
| CN-118119659-A | Flame-retardant epoxy resin composition | SIKA技术股份公司 | 2024-05-31 | — | — | CN | disclosed |
| WO-2024092601-A1 | TWO-COMPONENT EPOXY ADHESIVE FOR LIQUIFIED NATURAL GAS CONTAINERS | SIKA TECHNOLOGY AG (CH) | 2024-05-10 | — | — | WO | disclosed |
| CN-118019772-A | Cracking-resistant two-component epoxy resin composition | SIKA技术股份公司 | 2024-05-10 | — | — | CN | disclosed |
| US-11932786-B2 | Method for structurally joining substrates having different coefficients of linear thermal expansion | SIKA TECHNOLOGY AG (CH) | 2024-03-19 | — | — | US | disclosed |
| CN-117715997-A | Expandable one-component thermosetting epoxy adhesives with improved adhesion | SIKA技术股份公司 | 2024-03-15 | — | — | CN | disclosed |
| CN-101466753-A | Low-temperature impact resistant thermosetting epoxide resincompositions with solid epoxide resins | SIKA TECHNOLOGY AG (CH) | 2009-06-24 | — | — | CN | disclosed |
| EP-1939686-A1 | Holographic recording medium | Kabushiki Kaisha Toshiba (JP) | 2008-07-02 | — | — | EP | disclosed |
| US-20080145766-A1 | Holographic recording medium | KABUSHIKI KAISHA TOSHIBA | 2008-06-19 | — | — | US | disclosed |
| US-20070105983-A1 | Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures | SIKA TECHNOLOGY AG (CH) | 2007-05-10 | — | — | US | disclosed |
| US-20070066721-A1 | Heat-curable compositions comprising low-temperature impact strength modifiers | SIKA TECHNOLOGY AG (CH) | 2007-03-22 | — | — | US | disclosed |
| CN-1264924-C | Thermosetting polyimide resin composition and method for producing polyimide resin | DAINIPPON INK & CHEMICALS (JP) | 2006-07-19 | — | — | CN | disclosed |
| CN-1726242-A | Heat-hardenable epoxy resin compositions with improved low-temperature impact strength | SIKA TECHNOLOGY AG (CH) | 2006-01-25 | — | — | CN | disclosed |
| CN-1435448-A | Thermosetting polyimide resin composition and method for producing polyimide resin | DAINIPPON INK & CHEMICALS (JP) | 2003-08-13 | — | — | CN | disclosed |
| US-5162547-A | PROCESS FOR THE PREPARATION OF GLYCIDYL ETHERS | CIBA-GEIGY CORPORATION (US) | 1992-11-10 | — | — | US | disclosed |