SCHEMBL4094256

SCHEMBL4094256

CC1(C)CC(N(C=O)CCCCO)CC(C)(C)N1

nearest known ligand 0.42

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ADH1A P07327 3/20 0.42
ADH1C P00326 2/20 0.42
ADH4 P08319 1/20 0.42
GAA P10253 1/20 0.31
ALOX15 P16050 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7518630 0.95 ADH1A (0.40) ADH1AADH1CADH4GAAALOX15
SCHEMBL20200266 0.90 ADH1A (0.51) ADH1AADH1CADH4GAAALOX15
SCHEMBL77345 0.90 ADH1A (0.51) ADH1AADH1CADH4GAAALOX15
SCHEMBL14263284 0.90 ADH1A (0.51) ADH1AADH1CADH4GAAALOX15
SCHEMBL14142383 0.89 ADH1A (0.44) ADH1AADH1CADH4GAAALOX15
SCHEMBL3842317 0.86 ADH1A (0.60) ADH1AADH1CADH4
SCHEMBL3301547 0.85 ADH1A (0.41) ADH1AADH1CADH4GAAALOX15
SCHEMBL20112925 0.84 ADH1A (0.46) ADH1AADH1CADH4ALOX15
SCHEMBL3842003 0.84 ADH1A (0.63) ADH1AADH1CADH4
SCHEMBL3840058 0.84 ADH1A (0.63) ADH1AADH1CADH4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2930210-B1 RESIN COMPOSITION FOR SEALING ORGANIC ELECTRONICS DEVICES AND ORGANIC ELECTRONICS DEVICE ZEON CORP (JP) 2023-01-25 EP disclosed
US-10707442-B2 Composite gas barrier multilayer body, method for producing the same, and composite electrode ZEON CORPORATION (JP) 2020-07-07 US disclosed
EP-3089551-B1 SEALING FILM, ORGANIC ELECTROLUMINESCENT DISPLAY, AND ORGANIC SEMICONDUCTOR DEVICE ZEON CORP (JP) 2020-04-15 EP disclosed
US-10559778-B2 Composite gas barrier laminate and method for producing same ZEON CORPORATION (JP) 2020-02-11 US disclosed
US-20190334116-A1 METHOD FOR MANUFACTURING SEALING MATERIAL, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE ZEON CORPORATION (JP) 2019-10-31 US disclosed
US-10374190-B2 Sealing film, organic electroluminescent display, and organic semiconductor device ZEON CORPORATION (JP) 2019-08-06 US disclosed
CN-108559217-A The film and organic electronic device of organic electronic device resin composition for encapsulating 日本瑞翁株式会社 2018-09-21 CN disclosed
US-20180102500-A1 SEALING MATERIAL, METHOD FOR MANUFACTURING SEALING MATERIAL, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE ZEON CORPORATION (JP) 2018-04-12 US disclosed
CN-104854190-B Resin composition for sealing organic electronic device and organic electronic device 日本瑞翁株式会社 2018-03-23 CN disclosed
EP-3277055-A1 SEALING MATERIAL, METHOD FOR MANUFACTURING SEALING MATERIAL, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE Zeon Corporation (JP) 2018-01-31 EP disclosed
EP-2930210-A1 RESIN COMPOSITION FOR SEALING ORGANIC ELECTRONICS DEVICES AND ORGANIC ELECTRONICS DEVICE Zeon Corporation (JP) 2015-10-14 EP disclosed
US-20150249228-A1 COMPOSITE GAS BARRIER MULTILAYER BODY, METHOD FOR PRODUCING THE SAME, AND COMPOSITE ELECTRODE ZEON CORPORATION (JP) 2015-09-03 US disclosed
EP-2907657-A1 COMPOSITE GAS BARRIER LAMINATE AND METHOD FOR PRODUCING SAME, AND COMPOSITE ELECTRODE Zeon Corporation (JP) 2015-08-19 EP disclosed
CN-104854190-A Resin composition for sealing organic electronic device and organic electronic device ZEON CORP 2015-08-19 CN disclosed
CN-103249746-B Hydrogenated block copolymer having alkoxysilyl group and use thereof ZEON CORP 2015-05-06 CN disclosed
US-20130244367-A1 HYDROGENATED BLOCK COPOLYMER HAVING ALKOXYSILYL GROUP AND USE THEREFOR ZEON CORPORATION (JP) 2013-09-19 US disclosed
EP-2623526-A1 HYDROGENATED BLOCK COPOLYMER HAVING ALKOXYSILYL GROUP, AND USE THEREFOR Zeon Corporation (JP) 2013-08-07 EP disclosed
US-20130008506-A1 RESIN COMPOSITION FOR ENCAPSULATING SOLAR CELL AND SOLAR MODULE ZEON CORPORATION (JP) 2013-01-10 US disclosed
EP-2532692-A1 RESIN COMPOSITION FOR SEALING SOLAR CELL ELEMENT, AND SOLAR CELL MODULE Zeon Corporation (JP) 2012-12-12 EP disclosed
US-20090118400-A1 RESIN COMPOSITION ZEON CORPORATION (JP) 2009-05-07 US disclosed