SCHEMBL4094369

SCHEMBL4094369

NC1(N)C=CC(=C2C=CC(N)(N)C=C2)C=C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acetic Acid SCHEMBL31339534 0.81 FFAR3 (0.35)
SCHEMBL31106514 0.78
SCHEMBL14304241 0.73
SCHEMBL5147224 0.72
SCHEMBL22500166 0.69
SCHEMBL31193231 0.60
SCHEMBL11376809 0.52
SCHEMBL300801 0.49 IDO1 (0.31)
SCHEMBL14492437 0.46
SCHEMBL7944187 0.46

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 109 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118480208-A Preparation method of polyimide nano porous film regulated and controlled by amphiphilic polymer 富优特(山东)新材料科技有限公司 2024-08-13 CN claimed
CN-118165319-A Silicon-containing heterocyclic aramid film with high-temperature energy storage and electric etching resistance and preparation method thereof 四川大学 2024-06-11 CN claimed
CN-117586742-A Adhesive for lithium ion battery and preparation method thereof 桂林电器科学研究院有限公司 2024-02-23 CN claimed
CN-117304438-A Polyurethane composition, polyurethane adhesive and flexible copper-clad plate containing adhesive 杭州福斯特电子材料有限公司 2023-12-29 CN claimed
CN-116693901-A Multiband infrared high-permeability hydrophobic flexible composite polyimide film material and preparation method thereof 中国科学院光电技术研究所 2023-09-05 CN claimed
CN-116496538-A Preparation method of polyimide composite film 珠海长先新材料科技股份有限公司 2023-07-28 CN claimed
CN-112225919-B Geomembrane for soil remediation engineering and preparation method thereof 王平 2023-07-25 CN claimed
CN-111704735-B Polyimide optical film material with ultralow thermal expansion coefficient and high strength and preparation method thereof 中国科学院光电技术研究所 2023-05-26 CN claimed
WO-2022228449-A1 PREPARATION METHOD FOR POLYIMIDE RESIN AND THIN FILM THEREOF 上海瑞暨新材料科技有限公司 2022-11-03 WO claimed
CN-121591973-A Magnetic amide functionalized covalent organic framework material and preparation method and application thereof 浙江农林大学 2026-03-03 CN disclosed
CN-120059250-A Method for regulating and controlling polyimide film high-temperature energy storage through regulating molecular structure 哈尔滨理工大学 2025-05-30 CN disclosed
CN-119371660-B Block structure thermoplastic polyimide resin and preparation method thereof 科谟(上海)新材料科技有限公司 2025-05-30 CN disclosed
CN-114008525-B Method for producing purified resist composition, method for forming resist pattern, and purified resist composition 东京应化工业株式会社 2025-05-23 CN disclosed
CN-120005508-A Preparation method and application of water-cooling plate coating with multiple polyimide layers 上海瑞暨新材料科技有限公司 2025-05-16 CN disclosed
EP-0426883-A1 Modulus modification of water borne polyurethane-ureas THE DOW CHEMICAL COMPANY (US) 1991-05-15 EP disclosed
US-5008325-A Grafted hydrophobic polymer particles for protective coatings; tensile strength THE DOW CHEMICAL COMPANY (US) 1991-04-16 US disclosed
EP-0407968-A2 Semi-continuous process for the preparation of polyurethaneurea aqueous dispersions THE DOW CHEMICAL COMPANY (US) 1991-01-16 EP disclosed
EP-0369271-A2 Antistatic polyurethane-urea dispersions THE DOW CHEMICAL COMPANY (US) 1990-05-23 EP disclosed
US-4920167-A Containing nonvolatile salt THE DOW CHEMICAL COMPANY (US) 1990-04-24 US disclosed
US-4895894-A CATIONIC POLYMERS THE DOW CHEMICAL COMPANY (US) 1990-01-23 US disclosed