⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30493029 | 0.83 | — | — | |
| SCHEMBL18771851 | 0.78 | NOS3 (0.33) | — | |
| SCHEMBL24339450 | 0.78 | — | — | |
| SCHEMBL19075292 | 0.73 | NOS3 (0.31) | — | |
| SCHEMBL4094369 | 0.72 | — | — | |
| SCHEMBL28780258 | 0.70 | — | — | |
| SCHEMBL24930875 | 0.69 | — | — | |
| SCHEMBL24339003 | 0.69 | — | — | |
| SCHEMBL14492437 | 0.69 | — | — | |
| SCHEMBL23888852 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024225072-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND CURED FILM | 旭化成株式会社 | 2024-10-31 | — | — | WO | disclosed |
| WO-2024210063-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, CURED FILM, AND SEMICONDUCTOR DEVICE | 旭化成株式会社 | 2024-10-10 | — | — | WO | disclosed |
| US-20240182645-A1 | POLY(AMIC ACID) COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE, AND LAMINATE | MITSUI CHEMICALS, INC. (JP) | 2024-06-06 | — | — | US | disclosed |
| US-20240182765-A1 | POLYAMIC ACID COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE AND LAMINATE | MITSUI CHEMICALS, INC. (JP) | 2024-06-06 | — | — | US | disclosed |
| CN-113555552-B | Polyimide binder and negative plate | 浙江中科玖源新材料有限公司 | 2023-04-07 | — | — | CN | disclosed |
| WO-2022210321-A1 | POLY(AMIC ACID) COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE, AND LAYERED PRODUCT | 三井化学株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022202416-A1 | POLYAMIDE ACID COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE AND LAMINATE | 三井化学株式会社 | 2022-09-29 | — | — | WO | disclosed |
| US-10988647-B2 | Semiconductor substrate manufacturing method, semiconductor device, and method for manufacturing same | MITSUI CHEMICALS, INC. (JP) | 2021-04-27 | — | — | US | disclosed |
| US-10907025-B1 | Polyamide/polyimide aerogels | UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) | 2021-02-02 | — | — | US | disclosed |
| US-20200377772-A1 | SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME | MITSUI CHEMICALS, INC. (JP) | 2020-12-03 | — | — | US | disclosed |
| US-10066073-B1 | Polyamide/polyimide aerogels | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) | 2018-09-04 | — | — | US | disclosed |
| CN-103732403-B | Electromagnetic wave shielding component | MITSUI CHEMICALS, INC. (JP) | 2015-12-02 | — | — | CN | disclosed |
| US-20130288120-A1 | POLYIMIDE RESIN COMPOSITION AND LAMINATE INCLUDING POLYIMIDE RESIN COMPOSITION | MITSUI CHEMICALS INC. (JP) | 2013-10-31 | — | — | US | disclosed |
| EP-2612879-A1 | POLYIMIDE RESIN COMPOSITION AND LAMINATE INCLUDING SAME | Mitsui Chemicals, Inc. (JP) | 2013-07-10 | — | — | EP | disclosed |
| US-20070169886-A1 | Heat-resistant resin laminated film, multilayer film with metal layer including same and semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2007-07-26 | — | — | US | disclosed |
| EP-1721740-A1 | HEAT-RESISTANT RESIN LAMINATED FILM, MULTILAYER FILM WITH METAL LAYER INCLUDING SAME, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2006-11-15 | — | — | EP | disclosed |
| US-20060004180-A1 | Solution compositions of block copolyimides comprising pyromellitic dianhydride and process for production thereof | PI R&D CO., LTD. (JP) | 2006-01-05 | — | — | US | disclosed |
| EP-1561786-A1 | SOLUTION COMPOSITIONS OF BLOCK COPOLYIMIDES COMPRISING PYROMELLITIC DIANHYDRIDE AND PROCESS FOR PRODUCTION THEREOF | PI R & D Co., Ltd. (JP) | 2005-08-10 | — | — | EP | disclosed |
| EP-0303173-B1 | Sheet-form molded article composed of organic fiber and process for producing same | SUMITOMO CHEMICAL CO (JP) | 1993-12-15 | — | — | EP | disclosed |
| EP-0303173-A1 | Sheet-form molded article composed of organic fiber and process for producing same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1989-02-15 | — | — | EP | disclosed |