Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.45 |
| ▸ | GLA | P06280 | 1/20 | 0.45 |
| ▸ | TSHR | P16473 | 5/20 | 0.44 |
| ▸ | TP53 | P04637 | 4/20 | 0.44 |
| ▸ | HIF1A | Q16665 | 3/20 | 0.44 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.44 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.44 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.44 |
| ▸ | MAPT | P10636 | 2/20 | 0.40 |
| ▸ | HPGD | P15428 | 2/20 | 0.40 |
| ▸ | MEN1 | O00255 | 2/20 | 0.40 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.40 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.40 |
| ▸ | PPARG | P37231 | 1/20 | 0.40 |
| ▸ | VDR | P11473 | 1/20 | 0.37 |
| ▸ | PKM | P14618 | 2/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | GAA | P10253 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15031016 | 0.90 | ALDH1A1 (0.38) | ALDH1A1GLATSHRTP53HIF1A | |
| SCHEMBL23338276 | 0.90 | ALDH1A1 (0.38) | ALDH1A1GLATSHRTP53HIF1A | |
| SCHEMBL12608288 | 0.86 | ALDH1A1 (0.42) | ALDH1A1GLATSHRTP53HIF1A | |
| SCHEMBL1356636 | 0.85 | ALDH1A1 (0.51) | ALDH1A1GLATSHRTP53HIF1A | |
| SCHEMBL15346497 | 0.83 | ALDH1A1 (0.45) | ALDH1A1GLATSHRTP53HIF1A | |
| SCHEMBL10699786 | 0.80 | ALDH1A1 (0.45) | ALDH1A1GLATSHRTP53HIF1A | |
| SCHEMBL12396515 | 0.79 | ALDH1A1 (0.46) | ALDH1A1GLATSHRTP53HIF1A | |
| SCHEMBL20804439 | 0.77 | ALDH1A1 (0.51) | ALDH1A1GLATSHRTP53HIF1A | |
| SCHEMBL9091679 | 0.77 | ALDH1A1 (0.51) | ALDH1A1GLATSHRTP53HIF1A | |
| SCHEMBL12651399 | 0.76 | CNR2 (0.36) | ALDH1A1TSHRTP53HIF1ACYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023149327-A1 | PROTECTIVE FILM FORMING COMPOSITION | 日産化学株式会社 | 2023-08-10 | — | — | WO | disclosed |
| US-20220404706-A1 | CHEMICAL-RESISTANT POLYVALENT CARBOXYLIC ACID-CONTAINING PROTECTIVE FILM | NISSAN CHEMICAL CORPORATION (JP) | 2022-12-22 | — | — | US | disclosed |
| US-20220153920-A1 | METHOD FOR PRODUCING POLYMER | NISSAN CHEMICAL CORPORATION (JP) | 2022-05-19 | — | — | US | disclosed |
| US-20220145119-A1 | CHEMICAL SOLUTION-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CONTAINING POLYMERIZATION PRODUCT HAVING DIOL STRUCTURE AT TERMINAL THEREOF | NISSAN CHEMICAL CORPORATION (JP) | 2022-05-12 | — | — | US | disclosed |
| US-20210403635-A1 | CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION CONTAINING POLYMERIZATION PRODUCT OF ARYLENE COMPOUND HAVING GLYCIDYL GROUP | NISSAN CHEMICAL CORPORATION (JP) | 2021-12-30 | — | — | US | disclosed |
| WO-2020166580-A1 | METHOD FOR PRODUCING POLYMER | 日産化学株式会社 | 2020-08-20 | — | — | WO | disclosed |
| US-8883883-B2 | Resin composition for encapsulating semiconductor and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2014-11-11 | — | — | US | disclosed |
| US-8883883-B2 | Resin composition for encapsulating semiconductor and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2014-11-11 | — | — | US | disclosed |
| US-8653205-B2 | Resin composition for encapsulating semiconductor and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2014-02-18 | — | — | US | disclosed |
| US-8653205-B2 | Resin composition for encapsulating semiconductor and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2014-02-18 | — | — | US | disclosed |
| US-20130289187-A1 | RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2013-10-31 | — | — | US | disclosed |
| US-8552572-B2 | Resin composition for encapsulating semiconductor and semiconductor device using the same | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-10-08 | — | — | US | disclosed |
| US-8552572-B2 | Resin composition for encapsulating semiconductor and semiconductor device using the same | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-10-08 | — | — | US | disclosed |
| US-8465666-B2 | Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition | PANASONIC CORPORATION (JP) | 2013-06-18 | — | — | US | disclosed |
| US-20120061861-A1 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-03-15 | — | — | US | disclosed |
| US-20120061861-A1 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-03-15 | — | — | US | disclosed |
| US-20120025132-A1 | THERMOCONDUCTIVE COMPOSITION, HEAT DISSIPATING PLATE, HEAT DISSIPATING SUBSTRATE AND CIRCUIT MODULE USING THERMOCONDUCTIVE COMPOSITION, AND PROCESS FOR PRODUCTION OF THERMOCONDUCTIVE COMPOSITION | PANASONIC CORPORATION (JP) | 2012-02-02 | — | — | US | disclosed |
| US-20120001350-A1 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-01-05 | — | — | US | disclosed |
| US-20120001350-A1 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-01-05 | — | — | US | disclosed |
| JP-2001130139-A | THERMOSENSITIVE RECORDING MATERIAL | OJI PAPER CO LTD | 2001-05-15 | — | — | JP | disclosed |