SCHEMBL4110370

SCHEMBL4110370

COCCOC.[Cu]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1154 0.94 — —
SCHEMBL251442 0.94 ALDH1A1 (0.33) —
Hydrogen Sulfide SCHEMBL20377931 0.89 — —
SCHEMBL15375922 0.89 — —
SCHEMBL7753285 0.89 — —
Water SCHEMBL127130 0.89 — —
Bromide SCHEMBL1450110 0.89 — —
Hydrochloric Acid SCHEMBL7542073 0.89 TSHR (0.32) —
SCHEMBL21641734 0.89 — —
Hydrochloric Acid SCHEMBL22129249 0.89 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090136719-A1 SURFACE GRAFT MATERIAL AND ITS MANUFACTURING METHOD, ELECTRICALLY CONDUCTIVE MATERIAL AND ITS MANUFACTURING METHOD, AND ELECTRICALLY CONDUCTIVE PATTERN MATERIAL FUJIFILM CORPORATION (JP) 2009-05-28 — — US disclosed
EP-1871826-A1 SURFACE GRAFT MATERIAL AND ITS MANUFACTURING METHOD, ELECTRICALLY CONDUCTIVE MATERIAL AND ITS MANUFACTURING METHOD, AND ELECTRICALLY CONDUCTIVE PATTERN MATERIAL FUJIFILM CORPORATION (JP) 2008-01-02 — — EP disclosed
WO-2006104279-A1 SURFACE GRAFT MATERIAL AND ITS MANUFACTURING METHOD, ELECTRICALLY CONDUCTIVE MATERIAL AND ITS MANUFACTURING METHOD, AND ELECTRICALLY CONDUCTIVE PATTERN MATERIAL FUJIFILM CORPORATION (JP) 2006-10-05 — — WO disclosed
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