SCHEMBL4115446

SCHEMBL4115446

COC(=O)NC(OC)(OC)[SiH2]C

nearest known ligand 0.33

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
MGAM O43451 1/20 0.33
GAA P10253 1/20 0.33
SI P14410 1/20 0.33
MGAM2 Q2M2H8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL142088 0.81
SCHEMBL19136075 0.79 MGAM (0.33) MGAMGAASIMGAM2
SCHEMBL3175996 0.69 ALDH1A1 (0.35) MGAMGAASIMGAM2
SCHEMBL554657 0.68
SCHEMBL2757922 0.66
SCHEMBL9720283 0.66 ALDH1A1 (0.37) MGAMGAASIMGAM2
SCHEMBL21440375 0.64
SCHEMBL2809598 0.64
SCHEMBL6978891 0.62 NPC1 (0.38) GAA
SCHEMBL19115289 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10301433-B2 Curable organopolysiloxane compositions WACKER CHEMIE AG (DE) 2019-05-28 US disclosed
US-20170210856-A1 CURABLE ORGANOPOLYSILOXANE COMPOSITIONS WACKER CHEMIE AG (DE) 2017-07-27 US disclosed
US-9249262-B2 Curable organic polymer and method for production thereof, and curable composition containing the same KANEKA CORPORATION (JP) 2016-02-02 US disclosed
US-8710120-B2 Cross-linkable compositions WACKER CHEMIE AG (DE) 2014-04-29 US disclosed
US-8293368-B2 Moisture-curable composition featuring increased elasticity SIKA TECHNOLOGY AG (CH) 2012-10-23 US disclosed
US-20120202919-A1 CROSS-LINKABLE COMPOSITIONS WACKER CHEMIE AG (DE) 2012-08-09 US disclosed
US-20090247712-A1 CURABLE ORGANIC POLYMER AND METHOD FOR PRODUCTION THEREOF, AND CURABLE COMPOSITION CONTAINING THE SAME KANEKA CORPORATION (JP) 2009-10-01 US disclosed
US-20090075086-A1 Moisture-Curable Composition Featuring Increased Elasticity SIKA TECHNOLOGY AG (CH) 2009-03-19 US disclosed