Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 1/20 | 0.59 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.51 |
| ▸ | HTT | P42858 | 2/20 | 0.43 |
| ▸ | TSHR | P16473 | 2/20 | 0.43 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.43 |
| ▸ | GALR3 | O60755 | 1/20 | 0.43 |
| ▸ | LMNA | P02545 | 1/20 | 0.43 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.43 |
| ▸ | RAB9A | P51151 | 1/20 | 0.43 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.43 |
| ▸ | ADORA2B | P29275 | 4/20 | 0.42 |
| ▸ | PDE4A | P27815 | 2/20 | 0.42 |
| ▸ | ADORA2A | P29274 | 2/20 | 0.42 |
| ▸ | PDE4B | Q07343 | 2/20 | 0.42 |
| ▸ | PDE4C | Q08493 | 2/20 | 0.42 |
| ▸ | PDE4D | Q08499 | 2/20 | 0.42 |
| ▸ | USP2 | O75604 | 2/20 | 0.42 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.42 |
| ▸ | PTGS1 | P23219 | 3/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4112389 | 1.00 | CYP3A4 (0.59) | CYP3A4NPSR1HTTTSHRSMN1; SMN2 | |
| SCHEMBL11357417 | 1.00 | CYP3A4 (0.59) | CYP3A4NPSR1HTTTSHRSMN1; SMN2 | |
| SCHEMBL4106817 | 1.00 | CYP3A4 (0.59) | CYP3A4NPSR1HTTTSHRSMN1; SMN2 | |
| SCHEMBL13198600 | 1.00 | CYP3A4 (0.59) | CYP3A4NPSR1HTTTSHRSMN1; SMN2 | |
| SCHEMBL4117807 | 1.00 | CYP3A4 (0.59) | CYP3A4NPSR1HTTTSHRSMN1; SMN2 | |
| SCHEMBL25388740 | 1.00 | CYP3A4 (0.59) | CYP3A4NPSR1HTTTSHRSMN1; SMN2 | |
| SCHEMBL17145006 | 1.00 | CYP3A4 (0.59) | CYP3A4NPSR1HTTTSHRSMN1; SMN2 | |
| SCHEMBL13198601 | 1.00 | CYP3A4 (0.59) | CYP3A4NPSR1HTTTSHRSMN1; SMN2 | |
| SCHEMBL20737983 | 1.00 | CYP3A4 (0.59) | CYP3A4NPSR1HTTTSHRSMN1; SMN2 | |
| SCHEMBL13198597 | 0.98 | CYP3A4 (0.61) | CYP3A4NPSR1HTTTSHRSMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4256558-A | EXTRUSION OF A BLEND OF POLYETHYLENE TEREPHTHALATE AND A DIALLYL COMPOUND FOLLOWED BY RADIATION CURING; FILMS AND FILAMENTS HAVING GOOD HEAT RESISTANCE AND PHOTOSTABILITY | TEIJIN LIMITED (JP) | 1981-03-17 | — | — | US | claimed |
| WO-2023210567-A1 | RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL CLAD LAMINATED PLATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE, AND PRINTED WIRING BOARD MANUFACTURING METHOD | 三菱瓦斯化学株式会社 | 2023-11-02 | — | — | WO | disclosed |
| WO-2023176765-A1 | HYDROXY RESIN, STYRENE RESIN, METHOD FOR PRODUCING HYDROXY RESIN, METHOD FOR PRODUCING STYRENE RESIN, AND APPLICATIONS THEREOF | 三菱瓦斯化学株式会社 | 2023-09-21 | — | — | WO | disclosed |
| WO-2023176764-A1 | RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2023-09-21 | — | — | WO | disclosed |
| WO-2023176766-A1 | RESIN, RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2023-09-21 | — | — | WO | disclosed |
| WO-2023176763-A1 | RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2023-09-21 | — | — | WO | disclosed |
| WO-2023171553-A1 | RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2023-09-14 | — | — | WO | disclosed |
| WO-2023171554-A1 | RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2023-09-14 | — | — | WO | disclosed |
| CN-115916535-A | Resin composition, prepreg using same, resin-containing film, resin-containing metal foil, metal-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2023-04-04 | — | — | CN | disclosed |
| WO-2015149222-A1 | CROSSLINKABLE POLYMERIC COMPOSITIONS WITH DIALLYL ISOCYANURATE CROSSLINKING COAGENTS, METHODS FOR MAKING THE SAME, AND ARTICLES MADE THEREFROM | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-10-08 | — | — | WO | disclosed |
| US-20090022990-A1 | HEAT-RESISTANT CROSS-LINKING POLYESTER FIBER AND FIBER CORD | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2009-01-22 | — | — | US | disclosed |
| EP-1876287-A1 | HEAT-RESISTANT CROSSLINKED POLYESTER FIBER AND FIBER CORD | Toyo Boseki Kabushiki Kasisha (JP) | 2008-01-09 | — | — | EP | disclosed |
| US-4002797-A | Lubricant for wires with enameled or lacquered insulation | SIEMENS AKTIENGESELLSCHAFT (DT) | 1977-01-11 | — | — | US | disclosed |