SCHEMBL4128830

SCHEMBL4128830

C=C(C=CC#N)C(=O)OC1CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL295003 0.76 TSHR (0.36)
SCHEMBL5972487 0.73 ALDH1A1 (0.39)
SCHEMBL14780680 0.73 ALDH1A1 (0.39)
SCHEMBL2260103 0.73 ALDH1A1 (0.53)
SCHEMBL4889790 0.70 EPHX1 (0.40)
Butadiene SCHEMBL9312044 0.69 ALDH1A1 (0.35)
SCHEMBL11813430 0.69 HCAR2 (0.38)
SCHEMBL3937425 0.69 HTT (0.34)
Vinyl Chloride SCHEMBL5430946 0.68 ALDH1A1 (0.47)
SCHEMBL3175102 0.68 HTT (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115595072-A High-strength PID (potential induced degradation) -resistant packaging adhesive film for lightweight photovoltaic module and preparation method thereof 江苏鹿山新材料有限公司(CN) 2023-01-13 CN claimed
CN-115595072-B High-strength PID-resistant packaging adhesive film for lightweight photovoltaic module and preparation method thereof 江苏鹿山新材料有限公司 2023-09-15 CN disclosed
CN-115595072-A High-strength PID (potential induced degradation) -resistant packaging adhesive film for lightweight photovoltaic module and preparation method thereof 江苏鹿山新材料有限公司(CN) 2023-01-13 CN disclosed
US-20090253834-A1 ADHESIVE COMPOSITIONS USEFUL IN FLEXIBLE CIRCUIT SUBSTRATE APPLICATIONS AND METHODS RELATING THERETO E. I. DU PONT DE NEMOURS AND COMPANY (US) 2009-10-08 US disclosed