SCHEMBL4146344

SCHEMBL4146344

O=C(OCC1CO1)c1cccc2c(C(=O)OCC3CO3)cccc12

nearest known ligand 0.62

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
DHFR P00374 1/20 0.62
MAPK1 P28482 1/20 0.47
L3MBTL1 Q9Y468 1/20 0.47
MGLL Q99685 4/20 0.46
ALDH1A1 P00352 3/20 0.43
KDM4E B2RXH2 1/20 0.43
TP53 P04637 2/20 0.42
CYP3A4 P08684 2/20 0.42
TSHR P16473 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
HIF1A Q16665 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31530692 0.93 DHFR (0.59) DHFRMAPK1L3MBTL1MGLL
SCHEMBL1715144 0.93 DHFR (0.59) DHFRMAPK1L3MBTL1MGLL
SCHEMBL9153659 0.91 DHFR (0.60) DHFRMAPK1L3MBTL1MGLLALDH1A1
SCHEMBL14959600 0.89 DHFR (0.53) DHFRMAPK1L3MBTL1MGLLALDH1A1
SCHEMBL121520 0.88 DHFR (0.59) DHFRMAPK1L3MBTL1MGLLALDH1A1
SCHEMBL29374975 0.88 DHFR (0.59) DHFRMAPK1L3MBTL1MGLLALDH1A1
SCHEMBL21801767 0.88 DHFR (0.59) DHFRMAPK1L3MBTL1MGLLALDH1A1
SCHEMBL23466923 0.88 DHFR (0.54) DHFRMAPK1L3MBTL1MGLL
SCHEMBL1715091 0.87 DHFR (0.55) DHFRMAPK1L3MBTL1MGLLALDH1A1
SCHEMBL20239041 0.87 DHFR (0.55) DHFRMAPK1L3MBTL1MGLLALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023058368-A1 METHOD FOR PRODUCING GLASS SUBSTRATE, PRETREATMENT METHOD FOR GLASS SUBSTRATE, AND METHOD FOR PRODUCING MULTILAYER BODY COMPRISING GLASS SUBSTRATE 日産化学株式会社 2023-04-13 WO disclosed
EP-1942179-B1 CHIP PROVIDED WITH FILM HAVING HOLE PATTERN WITH THE USE OF THERMORESPONSIVE POLYMER AND METHOD OF PRODUCING THE SAME TOYAMA PREFECTURE (JP) 2017-05-10 EP disclosed
US-8664003-B2 Chip provided with film having hole pattern with the use of thermoresponsive polymer and method of producing the same TOYAMA PREFECTURE (JP) 2014-03-04 US disclosed
US-20120301942-A1 CHIP PROVIDED WITH FILM HAVING HOLE PATTERN WITH THE USE OF THERMORESPONSIVE POLYMER AND METHOD OF PRODUCING THE SAME TOYAMA PREFECTURE (JP) 2012-11-29 US disclosed
US-20090130384-A1 Chip Provided with film Having Hole Pattern with the Use of Thermoresponsive Polymer and Method of Producing the Same TOYAMA PREFECTURE (JP) 2009-05-21 US disclosed
EP-1942179-A1 CHIP PROVIDED WITH FILM HAVING HOLE PATTERN WITH THE USE OF THERMORESPONSIVE POLYMER AND METHOD OF PRODUCING THE SAME Toyama Prefecture (JP) 2008-07-09 EP disclosed
US-4060656-A PHOTOPOLYMERIZATION TEIJIN LIMITED (JA) 1977-11-29 US disclosed