Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.41 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.31 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4140279 | 0.96 | TDP1 (0.43) | TDP1 | |
| Vinyl Ether SCHEMBL28082185 | 0.88 | TDP1 (0.41) | TDP1MAPK1HSD17B10 | |
| Propene SCHEMBL4467670 | 0.88 | TDP1 (0.44) | TDP1MAPK1HSD17B10 | |
| Propene SCHEMBL7175244 | 0.88 | TDP1 (0.44) | TDP1MAPK1HSD17B10 | |
| Propene SCHEMBL16179012 | 0.88 | TDP1 (0.44) | TDP1MAPK1HSD17B10 | |
| Ethylene SCHEMBL9475186 | 0.85 | TDP1 (0.48) | TDP1MAPK1HSD17B10 | |
| Ethylene SCHEMBL16010245 | 0.85 | TDP1 (0.48) | TDP1MAPK1HSD17B10 | |
| Ethylene SCHEMBL460053 | 0.85 | TDP1 (0.48) | TDP1MAPK1HSD17B10 | |
| Ethylene SCHEMBL20494941 | 0.85 | TDP1 (0.48) | TDP1MAPK1HSD17B10 | |
| Methoxymethane SCHEMBL183011 | 0.85 | TDP1 (0.48) | TDP1MAPK1HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3812446-B1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | AGC INC (JP) | 2023-06-28 | — | — | EP | disclosed |
| CN-110079276-B | Composition for heat cycle system and heat cycle system | ＡＧＣ株式会社 | 2022-01-14 | — | — | CN | disclosed |
| US-11072734-B2 | Composition for heat cycle system, and heat cycle system | AGC Inc. (JP) | 2021-07-27 | — | — | US | disclosed |
| EP-3812446-A1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | AGC INC. (JP) | 2021-04-28 | — | — | EP | disclosed |
| EP-3109304-B1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | AGC INC (JP) | 2021-01-13 | — | — | EP | disclosed |
| EP-3109302-B1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | AGC INC (JP) | 2020-08-05 | — | — | EP | disclosed |
| EP-3109301-B1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | AGC INC (JP) | 2020-06-03 | — | — | EP | disclosed |
| US-20190316016-A1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | AGC Inc. (JP) | 2019-10-17 | — | — | US | disclosed |
| US-10392546-B2 | Composition for heat cycle system, and heat cycle system | AGC Inc. (JP) | 2019-08-27 | — | — | US | disclosed |
| CN-110079276-A | Heat circulating system composition and heat circulating system | ＡＧＣ株式会社 | 2019-08-02 | — | — | CN | disclosed |
| EP-3109304-A1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | Asahi Glass Company, Limited (JP) | 2016-12-28 | — | — | EP | disclosed |
| EP-3109301-A1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | Asahi Glass Company, Limited (JP) | 2016-12-28 | — | — | EP | disclosed |
| US-20160355717-A1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | ASAHI GLASS COMPANY, LIMITED (JP) | 2016-12-08 | — | — | US | disclosed |
| US-20160355719-A1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | ASAHI GLASS COMPANY, LIMITED (JP) | 2016-12-08 | — | — | US | disclosed |
| US-20160333241-A1 | COMPOSITION FOR HEAT CYCLE SYSTEM, AND HEAT CYCLE SYSTEM | ASAHI GLASS COMPANY, LIMITED (JP) | 2016-11-17 | — | — | US | disclosed |
| CN-106062159-A | Composition for heat cycle system and heat cycle system | 旭硝子株式会社 | 2016-10-26 | — | — | CN | disclosed |
| CN-106029853-A | Composition for heat cycle system and heat cycle system | 旭硝子株式会社 | 2016-10-12 | — | — | CN | disclosed |
| US-20090010603-A1 | Resin Composition for Optical Packaging Material and Process for Preparing the Same, and Optical Packaging Material, Optical Packaging Component, and Optical Module | NIPPON SHOKUBAI CO., LTD. (JP) | 2009-01-08 | — | — | US | disclosed |
| WO-2006038735-A1 | RESIN COMPOSITION FOR OPTICAL PACKAGING MATERIAL AND PROCESS FOR PREPARING THE SAME, AND OPTICAL PACKAGING MATERIAL, OPTICAL PACKAGING COMPONENT, AND OPTICAL MODULE | NIPPON SHOKUBAI CO., LTD. (JP) | 2006-04-13 | — | — | WO | disclosed |
| EP-1339127-A1 | SOLID POLYMER ELECTROLYTE AND CELL CONTAINING THE ELECTROLYTE | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2003-08-27 | — | — | EP | disclosed |