SCHEMBL4150116

SCHEMBL4150116

O=C1C=CC(=O)N1CCCCCCCCCCCCN1C(=O)C=CC1=O.O=C1C=CC(=O)N1CCCCCCN1C(=O)C=CC1=O

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 11/20 1.00
FAAH O00519 6/20 1.00
ALDH1A1 P00352 2/20 1.00
LMNA P02545 2/20 1.00
MAPT P10636 2/20 1.00
NPSR1 Q6W5P4 2/20 1.00
HSP90AA1 P07900 1/20 1.00
TLR9 Q9NR96 1/20 1.00
TP53 P04637 1/20 1.00
PKM P14618 1/20 1.00
HPGD P15428 1/20 1.00
XBP1 P17861 1/20 1.00
MAPK1 P28482 1/20 1.00
HTT P42858 1/20 1.00
RECQL P46063 1/20 1.00
RAB9A P51151 1/20 1.00
SMN1; SMN2 Q16637 1/20 1.00
GPR35 Q9HC97 1/20 1.00
GPR55 Q9Y2T6 1/20 1.00
PTGS1 P23219 7/20 0.77

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL548132 1.00 MGLL (1.00) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL549065 1.00 MGLL (1.00) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL549042 1.00 MGLL (1.00) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL258626 1.00 MGLL (1.00) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL5383694 1.00 MGLL (1.00) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL20351983 1.00 MGLL (1.00) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL13815841 1.00 MGLL (1.00) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL141227 1.00 MGLL (1.00) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL818349 1.00 MGLL (1.00) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL9514249 0.97 MGLL (0.94) MGLLFAAHALDH1A1LMNAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20190203048-A1 Maleimide Resin Composition, Prepreg, Cured Product Of Same And Semiconductor Device NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2019-07-04 US disclosed
US-20090010603-A1 Resin Composition for Optical Packaging Material and Process for Preparing the Same, and Optical Packaging Material, Optical Packaging Component, and Optical Module NIPPON SHOKUBAI CO., LTD. (JP) 2009-01-08 US disclosed