Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 1/20 | 0.80 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.64 |
| ▸ | NPC1 | O15118 | 1/20 | 0.58 |
| ▸ | RAB9A | P51151 | 1/20 | 0.58 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.58 |
| ▸ | NR2F2 | P24468 | 1/20 | 0.55 |
| ▸ | PDE10A | Q9Y233 | 1/20 | 0.55 |
| ▸ | PARP1 | P09874 | 1/20 | 0.55 |
| ▸ | SPHK2 | Q9NRA0 | 1/20 | 0.55 |
| ▸ | SPHK1 | Q9NYA1 | 1/20 | 0.55 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6759145 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL3160193 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL3165188 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL6753973 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL3166862 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL1635316 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL2948425 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL21074081 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL21074131 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL6755298 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 87 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111954378-B | Copper oxide layer reduction repairing agent for copper bonding pad surface and normal-temperature in-situ reduction repairing method | 上海空间电源研究所 | 2024-07-09 | — | — | CN | claimed |
| CN-114752362-A | Nano-fluid type wide-temperature-zone heat conduction oil based on ionic liquid and preparation method | 四川大学 | 2022-07-15 | — | — | CN | claimed |
| CN-111375784-B | Method for preparing stable nano-silver gel | 宁夏师范学院 | 2022-07-12 | — | — | CN | claimed |
| CN-114437672-A | Ultra-high temperature heat conduction oil based on non-proton type ionic liquid and preparation method thereof | 四川大学 | 2022-05-06 | — | — | CN | claimed |
| CN-112048721-A | Azole compound-based copper foil anti-oxidation additive and preparation method thereof | 湖北工程学院 | 2020-12-08 | — | — | CN | claimed |
| CN-111954378-A | Reduction repairing agent for copper oxide layer on surface of copper bonding pad and normal-temperature in-situ reduction repairing method | 上海空间电源研究所 | 2020-11-17 | — | — | CN | claimed |
| CN-107365989-B | A kind of metal surface treating method and its metal protective film obtained | 东莞市富默克化工有限公司 | 2019-08-09 | — | — | CN | claimed |
| CN-105744753-B | Copper and copper alloy surface form anti-oxidation protection epithelium method on printed wiring board | 广东利尔化学有限公司 | 2018-06-15 | — | — | CN | claimed |
| CN-107365989-A | A kind of metal surface treating method and its obtained metal protective film | 东莞市富默克化工有限公司 | 2017-11-21 | — | — | CN | claimed |
| CN-105957809-A | HDI plate quick etching combined additive | 浙江振有电子股份有限公司 | 2016-09-21 | — | — | CN | claimed |
| CN-101697662-A | High heat-resistance organic solder ability preservative | SHENZHEN DEV ARVATO DUAL CHEMI | 2010-04-21 | — | — | CN | claimed |
| US-20090120534-A1 | Preflux Composition | BAIK YANG CHEMICAL CO. LTD. (KR) | 2009-05-14 | — | — | US | claimed |
| WO-2007007945-A1 | PREFLUX COMPOSITION | BAIK YANG CHEMICAL CO., LTD. (KR) | 2007-01-18 | — | — | WO | claimed |
| CN-1891393-A | Preflux composition | BAIK YANG CHEMICAL CO LTD (KR) | 2007-01-10 | — | — | CN | claimed |
| EP-0428260-B1 | Metal surface treatment agents | SANWA LAB LTD (JP) | 2000-01-05 | — | — | EP | claimed |
| EP-0562187-B1 | Process for production of copper through-hole printed wiring boards | SANWA LAB LTD (JP) | 1996-01-10 | — | — | EP | claimed |
| US-5275694-A | Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching | SANWA LABORATORY LTD. (JP) | 1994-01-04 | — | — | US | claimed |
| EP-0562187-A1 | Process for production of copper through-hole printed wiring boards | SANWA LABORATORY LTD. (JP) | 1993-09-29 | — | — | EP | claimed |
| US-5173130-A | Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating | SHIKOKU CHEMICALS CORPORATION (JP) | 1992-12-22 | — | — | US | claimed |
| EP-0428260-A2 | Metal surface treatment agents | SANWA LABORATORY LTD. (JP) | 1991-05-22 | — | — | EP | claimed |