Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 1/20 | 0.80 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.64 |
| ▸ | NPC1 | O15118 | 1/20 | 0.58 |
| ▸ | RAB9A | P51151 | 1/20 | 0.58 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.58 |
| ▸ | NR2F2 | P24468 | 1/20 | 0.55 |
| ▸ | PDE10A | Q9Y233 | 1/20 | 0.55 |
| ▸ | PARP1 | P09874 | 1/20 | 0.55 |
| ▸ | SPHK2 | Q9NRA0 | 1/20 | 0.55 |
| ▸ | SPHK1 | Q9NYA1 | 1/20 | 0.55 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6759145 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL3160193 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL3165188 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL6753973 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL3166862 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL4157093 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL2948425 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL21074081 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL21074131 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 | |
| SCHEMBL6755298 | 1.00 | POLB (0.80) | POLBDDAH1NPC1RAB9AALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 475 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20090120534-A1 | Preflux Composition | BAIK YANG CHEMICAL CO. LTD. (KR) | 2009-05-14 | — | — | US | claimed |
| WO-2007007945-A1 | PREFLUX COMPOSITION | BAIK YANG CHEMICAL CO., LTD. (KR) | 2007-01-18 | — | — | WO | claimed |
| CN-1891393-A | Preflux composition | BAIK YANG CHEMICAL CO LTD (KR) | 2007-01-10 | — | — | CN | claimed |
| EP-0428260-B1 | Metal surface treatment agents | SANWA LAB LTD (JP) | 2000-01-05 | — | — | EP | claimed |
| EP-0562187-B1 | Process for production of copper through-hole printed wiring boards | SANWA LAB LTD (JP) | 1996-01-10 | — | — | EP | claimed |
| US-5275694-A | Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching | SANWA LABORATORY LTD. (JP) | 1994-01-04 | — | — | US | claimed |
| EP-0562187-A1 | Process for production of copper through-hole printed wiring boards | SANWA LABORATORY LTD. (JP) | 1993-09-29 | — | — | EP | claimed |
| US-5173130-A | Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating | SHIKOKU CHEMICALS CORPORATION (JP) | 1992-12-22 | — | — | US | claimed |
| EP-0428260-A2 | Metal surface treatment agents | SANWA LABORATORY LTD. (JP) | 1991-05-22 | — | — | EP | claimed |
| US-20260108989-A1 | FLUX AND SOLDER PASTE | SENJU METAL INDUSTRY CO (JP) | 2026-04-23 | — | — | US | disclosed |
| US-12605794-B2 | Flux and solder paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2026-04-21 | — | — | US | disclosed |
| US-12605783-B2 | Method for manufacturing soldered products | DENSO CORPORATION (JP) | 2026-04-21 | — | — | US | disclosed |
| EP-4706873-A1 | FLUX AND SOLDER PASTE | Senju Metal Industry Co., Ltd. (JP) | 2026-03-11 | — | — | EP | disclosed |
| CN-119730985-B | Soldering flux and method for producing bonded body | 千住金属工业株式会社 | 2026-02-27 | — | — | CN | disclosed |
| US-5275694-A | Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching | SANWA LABORATORY LTD. (JP) | 1994-01-04 | — | — | US | disclosed |
| EP-0562187-A1 | Process for production of copper through-hole printed wiring boards | SANWA LABORATORY LTD. (JP) | 1993-09-29 | — | — | EP | disclosed |
| US-5173130-A | Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating | SHIKOKU CHEMICALS CORPORATION (JP) | 1992-12-22 | — | — | US | disclosed |
| EP-0513831-A1 | Method for use of preflux, printed wiring board, and method for production thereof | HITACHI TELECOM TECHNOLOGIES, LTD. (JP) | 1992-11-19 | — | — | EP | disclosed |
| EP-0428383-A1 | Process for surface treatment of copper and copper alloy | SHIKOKU CHEMICALS CORPORATION (JP) | 1991-05-22 | — | — | EP | disclosed |
| EP-0428260-A2 | Metal surface treatment agents | SANWA LABORATORY LTD. (JP) | 1991-05-22 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260108989-A1 | FLUX AND SOLDER PASTE | GRIN1, ROS1, PRXL2A | POLB 2181/4885DDAH1 2596/4885NPC1 3276/4885 |
| US-12605783-B2 | Method for manufacturing soldered products | ROS1, TFRC, MARK2 | POLB 3300/4885DDAH1 4830/4885NPC1 938/4885 |
| US-12605794-B2 | Flux and solder paste | RIOK2, TRA2B, BAG2 | POLB 644/4885DDAH1 1775/4885NPC1 3221/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.