Trifluoromethanesulfonic Acid

Trifluoromethanesulfonic Acid

SCHEMBL4167370

Cc1ccccc1C[S+](C)c1ccc(O)cc1.O=S(=O)([O-])C(F)(F)F

nearest known ligand 0.37

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KCNH2 Q12809 2/20 0.37
GPR3 P46089 2/20 0.33
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
KEAP1 Q14145 1/20 0.33
ESR1 P03372 2/20 0.32
TAS2R14 Q9NYV8 1/20 0.32
MAOB P27338 1/20 0.32
FFAR1 O14842 1/20 0.32
CA2 P00918 1/20 0.32
ALDH1A1 P00352 2/20 0.31
MAPT P10636 1/20 0.31
HTT P42858 1/20 0.31
CTBP2 P56545 1/20 0.31
KDM4E B2RXH2 1/20 0.31
GAA P10253 1/20 0.31
ATM Q13315 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
HSD11B1 P28845 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Trifluoromethanesulfonic Acid SCHEMBL3480268 0.86 MAOB (0.46) MEN1KMT2ATAS2R14MAOBCA2
SCHEMBL758837 0.85 ESR1 (0.39) MEN1KMT2AKEAP1ESR1MAOB
SCHEMBL29561503 0.85 ESR1 (0.39) MEN1KMT2AKEAP1ESR1MAOB
Trifluoromethanesulfonic Acid SCHEMBL4165796 0.84 KCNH2 (0.37) KCNH2MEN1KMT2ACA2ATM
Hydrochloric Acid SCHEMBL9331155 0.83 ESR1 (0.38) MEN1KMT2AKEAP1ESR1MAOB
Trifluoromethanesulfonic Acid SCHEMBL1741775 0.83 KCNH2 (0.41) KCNH2GPR3ESR1TAS2R14
SCHEMBL30217958 0.82 ESR1 (0.36) MEN1KMT2AKEAP1ESR1MAOB
SCHEMBL29843345 0.82 ESR1 (0.36) MEN1KMT2AKEAP1ESR1MAOB
SCHEMBL29819556 0.82 ESR1 (0.36) MEN1KMT2AKEAP1ESR1MAOB
SCHEMBL30423338 0.82 ESR2 (0.36) MEN1KMT2AKEAP1ESR1MAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12434998-B2 Resin-coated ultra-thin glass TORAY INDUSTRIES, INC. (JP) 2025-10-07 US disclosed
CN-116648353-B Resin coated ultra-thin plate glass and display device 东丽株式会社 2025-01-21 CN disclosed
US-20240199854-A1 COMPOSITION, CURED FILM, STRUCTURAL BODY, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND MANUFACTURING METHOD OF CURED FILM FUJIFLIM CORPORATION (JP) 2024-06-20 US disclosed
WO-2024057999-A1 COLORING COMPOSITION, CURED FILM, COLOR FILTER, DISPLAY DEVICE AND METHOD FOR PRODUCING CURED FILM 富士フイルム株式会社 2024-03-21 WO disclosed
WO-2023210418-A1 THERMOSETTING COMPOSITION, CURED PRODUCT, AND OPTICAL MEMBER 富士フイルム株式会社 2023-11-02 WO disclosed
WO-2023032746-A1 COMPOSITION, CURED FILM, STRUCTURE, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND METHOD FOR PRODUCING CURED FILM 富士フイルム株式会社 2023-03-09 WO disclosed
EP-4130087-A1 STEREOISOMER OF EPOXY COMPOUND, CURABLE COMPOSITION CONTAINING SAME, AND CURED OBJECT OBTAINED BY CURING CURABLE COMPOSITION ENEOS Corporation (JP) 2023-02-08 EP disclosed
WO-2022163191-A1 RESIN-COATED ULTRA-THIN GLASS 東レ株式会社 2022-08-04 WO disclosed
EP-3203320-B9 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES (JP) 2020-05-06 EP disclosed
WO-2020045214-A1 RESIN COMPOSITION AND CURED FILM OBTAINED THEREFROM 東レ株式会社 2020-03-05 WO disclosed
EP-2799928-B1 PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT TORAY INDUSTRIES (JP) 2019-05-22 EP disclosed
EP-1942150-B1 SILOXANE RESIN COMPOSITION AND METHOD FOR PRODUCING SAME TORAY INDUSTRIES (JP) 2018-08-22 EP disclosed
US-20170285477-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-05 US disclosed
EP-3203320-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Toray Industries, Inc. (JP) 2017-08-09 EP disclosed
US-9704724-B2 Photosensitive resin composition and method for producing semiconductor device TORAY INDUSTRIES, INC. (JP) 2017-07-11 US disclosed
EP-2799928-A1 PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT Toray Industries, Inc. (JP) 2014-11-05 EP disclosed
US-20140242787-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2014-08-28 US disclosed
US-20120237873-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM FORMED FROM THE SAME, AND DEVICE HAVING CURED FILM TORAY INDUSTRIES INC. (JP) 2012-09-20 US disclosed
US-20090105360-A1 SILOXANE RESIN COMPOSITION AND PRODUCTION METHOD THEREOF TORAY INDUSTRIES, INC. (JP) 2009-04-23 US disclosed
EP-1942150-A1 SILOXANE RESIN COMPOSITION AND METHOD FOR PRODUCING SAME TORAY INDUSTRIES, INC. (JP) 2008-07-09 EP disclosed