Silver

Silver

SCHEMBL4167944

[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[O-][Si]([O-])([O-])F.[O-][Si]([O-])([O-])F.[O-][Si]([O-])([O-])F.[O-][Si]([O-])([O-])F.[O-][Si]([O-])([O-])F.[O-][Si]([O-])([O-])F

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

folP

The experimentally established mechanism targets of Silver. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3914625 0.86
SCHEMBL221506 0.86
SCHEMBL10457716 0.86
SCHEMBL6704187 0.86
SCHEMBL8382747 0.86
SCHEMBL322421 0.86
SCHEMBL982831 0.86
SCHEMBL21066112 0.86
SCHEMBL21646130 0.86
SCHEMBL57541 0.86

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113248528-B Three-dimensional Ag (I) complex synthesized based on silver hexafluorosilicate and synthesis method and application thereof 天津师范大学 2022-05-31 CN disclosed
CN-113248528-B Three-dimensional Ag (I) complex synthesized based on silver hexafluorosilicate and synthesis method and application thereof 天津师范大学 2022-05-31 CN disclosed
CN-113248528-B Three-dimensional Ag (I) complex synthesized based on silver hexafluorosilicate and synthesis method and application thereof 天津师范大学 2022-05-31 CN disclosed
CN-113248528-A Three-dimensional Ag (I) complex synthesized based on silver hexafluorosilicate and synthesis method and application thereof 天津师范大学 2021-08-13 CN disclosed
CN-113248528-A Three-dimensional Ag (I) complex synthesized based on silver hexafluorosilicate and synthesis method and application thereof 天津师范大学 2021-08-13 CN disclosed
CN-113248528-A Three-dimensional Ag (I) complex synthesized based on silver hexafluorosilicate and synthesis method and application thereof 天津师范大学 2021-08-13 CN disclosed
EP-3668826-B1 ETHANE OXIDATIVE DEHYDROGENATION SHELL INT RESEARCH (NL) 2021-06-23 EP disclosed
EP-3668827-B1 ETHANE OXIDATIVE DEHYDROGENATION SHELL INT RESEARCH (NL) 2021-06-23 EP disclosed
US-20200223768-A1 ETHANE OXIDATIVE DEHYDROGENATION SHELL OIL CO (US) 2020-07-16 US disclosed
US-20200223769-A1 ETHANE OXIDATIVE DEHYDROGENATION SHELL OIL CO (US) 2020-07-16 US disclosed
US-8226807-B2 Composite coatings for whisker reduction ENTHONE INC. (US) 2012-07-24 US disclosed
US-20090145764-A1 COMPOSITE COATINGS FOR WHISKER REDUCTION ENTHONE INC. (US) 2009-06-11 US disclosed
US-20090145765-A1 COMPOSITE COATINGS FOR WHISKER REDUCTION ENTHONE INC. (US) 2009-06-11 US disclosed
US-7422793-B2 Non-toxic corrosion-protection rinses and seals based on rare earth elements UNIVERSITY OF DAYTON (US) 2008-09-09 US disclosed
US-7407711-B2 Non-toxic corrosion-protection conversion coats based on rare earth elements UNIVERSITY OF DAYTON (US) 2008-08-05 US disclosed
US-7294211-B2 Non-toxic corrosion-protection conversion coats based on cobalt UNIVERSITY OF DAYTON (US) 2007-11-13 US disclosed
US-7273540-B2 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film SHINRYO ELECTRONICS CO., LTD. (JP) 2007-09-25 US disclosed
US-7235142-B2 Non-toxic corrosion-protection rinses and seals based on cobalt UNIVERSITY OF DAYTON (US) 2007-06-26 US disclosed
US-20050184369-A1 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film SINRYO ELECTRONICS CO., LTD. (JP) 2005-08-25 US disclosed
EP-1553211-A1 TIN-SILVER-COPPER PLATING SOLUTION, PLATING FILM CONTAINING THE SAME, AND METHOD FOR FORMING THE PLATING FILM SHINRYO ELECTRONICS CO., LTD. (JP) 2005-07-13 EP disclosed