SCHEMBL4170761

SCHEMBL4170761

CO[SiH](CCCC(N)CCN)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3688975 0.87
SCHEMBL25267372 0.80
SCHEMBL28536116 0.78
SCHEMBL28519141 0.76 OPRM1 (0.42)
SCHEMBL28975976 0.76
SCHEMBL1183362 0.75 PLA2G1B (0.31)
SCHEMBL448076 0.74
SCHEMBL21495879 0.73
SCHEMBL7717448 0.72
SCHEMBL1605627 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12435248-B2 Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulation molded body, and method for manufacturing semiconductor package RESONAC CORPORATION (JP) 2025-10-07 US disclosed
US-20230174828-A1 TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING, LEAD FRAME PROVIDED WITH TEMPORARY PROTECTIVE FILM, ENCAPSULATION MOLDED BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE RESONAC CORPORATION (JP) 2023-06-08 US disclosed
US-20230178385-A1 TEMPORARY PROTECTION FILM FOR SEMICONDUCTOR ENCAPSULATION, PRODUCTION METHOD THEREFOR, LEAD FRAME WITH TEMPORARY PROTECTION FILM, TEMPORARILY PROTECTED ENCAPSULATION OBJECT, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE RESONAC CORPORATION (JP) 2023-06-08 US disclosed
US-20230167327-A1 AQUEOUS COATING COMPOSITION KANSAI PAINT CO., LTD. (JP) 2023-06-01 US disclosed
CN-115916913-A Aqueous coating composition 关西涂料株式会社 2023-04-04 CN disclosed
CN-115335973-A Temporary protective film for semiconductor encapsulation molding, lead frame with temporary protective film, molded encapsulation, and method for manufacturing semiconductor package 昭和电工材料株式会社 2022-11-11 CN disclosed
CN-115335990-A Temporary protective film for semiconductor encapsulation molding and method for manufacturing the same, lead frame with temporary protective film, encapsulated molded body to be temporarily protected, and method for manufacturing semiconductor package 昭和电工材料株式会社 2022-11-11 CN disclosed
US-9017914-B2 Toner for developing electrostatic latent image KYOCERA DOCUMENT SOLUTIONS INC. (JP) 2015-04-28 US disclosed
EP-2508950-B1 Toner for developing electrostatic latent image KYOCERA DOCUMENT SOLUTIONS INC (JP) 2014-07-02 EP disclosed
US-20120258395-A1 TONER FOR DEVELOPING ELECTROSTATIC LATENT IMAGE KYOCERA DOCUMENT SOLUTIONS INC. (JP) 2012-10-11 US disclosed
EP-2508950-A1 Toner for developing electrostatic latent image Kyocera Document Solutions Inc. (JP) 2012-10-10 EP disclosed
US-20120171498-A1 INTERMEDIATE FILM FOR LAMINATED GLASS, AND LAMINATED GLASS SEKISUI CHEMICAL CO., LTD. (JP) 2012-07-05 US disclosed
EP-2471760-A1 INTERMEDIATE FILM FOR LAMINATED GLASS, AND LAMINATED GLASS Sekisui Chemical Co., Ltd. (JP) 2012-07-04 EP disclosed
US-20090246517-A1 Process for producing laminated glass composed partly of plastic sheet, and laminated glass SEKISUI CHEMICAL CO., LTD. (JP) 2009-10-01 US disclosed
EP-1930150-A1 METHOD FOR PRODUCING LAMINATED GLASS PARTIALLY MADE OF PLASTIC PLATE, AND LAMINATED GLASS Sekisui Chemical Co., Ltd. (JP) 2008-06-11 EP disclosed
US-7138214-B2 Positively chargeable toner KONICA MINOLTA BUSINESS TECHNOLOGIES, INC. (JP) 2006-11-21 US disclosed
US-20050064312-A1 Positively chargeable toner KONICA MINOLTA BUSINESS TECHNOLOGIES, INC. (JP) 2005-03-24 US disclosed
US-6706457-B2 FOR OBTAINING STABLE IMAGES HAVING MINIMAL BACK GROUND FOGGING, PROPER IMAGE DENSITY, NO IMAGE DENSITY UNEVENNESS, AND NO VOIDS IN IMAGE, SUPERIOR SOLID BLACK REPRODUCIBILITY TOMOEGAWA PAPER CO., LTD. (JP) 2004-03-16 US disclosed