SCHEMBL4173209

SCHEMBL4173209

C=C([SiH3])COCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5427040 0.87
SCHEMBL5418478 0.78
SCHEMBL7773048 0.75 ALDH1A1 (0.38)
SCHEMBL4676186 0.73
SCHEMBL678592 0.73
SCHEMBL229103 0.73
SCHEMBL12853943 0.71
SCHEMBL10283590 0.71
SCHEMBL8595992 0.71
SCHEMBL27090352 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116323246-A Conjugated diene polymer, rubber composition, rubber crosslinked product, and tire 瑞住合成橡胶株式会社 2023-06-23 CN disclosed
WO-2022255290-A1 METHOD FOR MANUFACTURING PLANARIZING FILM, PLANARIZING FILM MATERIAL, AND PLANARIZING FILM 東ソー株式会社 2022-12-08 WO disclosed
WO-2022230944-A1 PLANARIZING FILM MANUFACTURING METHOD, PLANARIZING FILM MATERIAL, AND PLANARIZING FILM 東ソー株式会社 2022-11-03 WO disclosed
US-11020825-B2 Connecting material and connection structure SEKISUI CHEMICAL CO., LTD. (JP) 2021-06-01 US disclosed
US-20180297153-A1 CONNECTING MATERIAL AND CONNECTION STRUCTURE SEKISUI CHEMICAL CO., LTD. (JP) 2018-10-18 US disclosed
US-9512272-B2 Curable composition containing silicone, and cured product thereof CENTRAL GLASS COMPANY, LIMITED (JP) 2016-12-06 US disclosed
US-20150322211-A1 Curable Composition Containing Silicone, and Cured Product Thereof CENTRAL GLASS COMPANY, LIMITED (JP) 2015-11-12 US disclosed
WO-2009051443-A2 PHOTOACTIVE COMPOSITION COMPRISING SCORIA AND PREPARATION METHOD THEREOF NURIDLE CO., LTD. (KR) 2009-04-23 WO disclosed
US-5622784-A WATERPROOFING; MODIFIED SILICON DIOXIDE THIN FILM SEIKO EPSON CORPORATION (JP) 1997-04-22 US disclosed