SCHEMBL4173213

SCHEMBL4173213

C=C[SiH2]COCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29277799 0.74
SCHEMBL5694372 0.71
SCHEMBL29277792 0.69
SCHEMBL28956857 0.67
Ether SCHEMBL9814449 0.65 ALDH1A1 (0.35)
Ether SCHEMBL599650 0.65
Ether SCHEMBL1766220 0.65 ALDH1A1 (0.35)
Ether SCHEMBL21930394 0.65
SCHEMBL323484 0.65
Ether SCHEMBL1001468 0.65 ALDH1A1 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250188615-A1 Gapfill Methods and Processing Assemblies ASM IP HOLDING B.V. (NL) 2025-06-12 US disclosed
US-12252790-B2 Gapfill methods and processing assemblies ASM IP HOLDING B.V. (NL) 2025-03-18 US disclosed
US-20240117494-A1 Gapfill methods and processing assemblies ASM IP HOLDING B.V. (NL) 2024-04-11 US disclosed
CN-117355632-A Method for producing planarizing film, material for planarizing film, and planarizing film 东曹株式会社 2024-01-05 CN disclosed
CN-116323246-A Conjugated diene polymer, rubber composition, rubber crosslinked product, and tire 瑞住合成橡胶株式会社 2023-06-23 CN disclosed
WO-2022255290-A1 METHOD FOR MANUFACTURING PLANARIZING FILM, PLANARIZING FILM MATERIAL, AND PLANARIZING FILM 東ソー株式会社 2022-12-08 WO disclosed
WO-2022230944-A1 PLANARIZING FILM MANUFACTURING METHOD, PLANARIZING FILM MATERIAL, AND PLANARIZING FILM 東ソー株式会社 2022-11-03 WO disclosed
US-11020825-B2 Connecting material and connection structure SEKISUI CHEMICAL CO., LTD. (JP) 2021-06-01 US disclosed
US-20180297153-A1 CONNECTING MATERIAL AND CONNECTION STRUCTURE SEKISUI CHEMICAL CO., LTD. (JP) 2018-10-18 US disclosed
US-9512272-B2 Curable composition containing silicone, and cured product thereof CENTRAL GLASS COMPANY, LIMITED (JP) 2016-12-06 US disclosed
US-20150322211-A1 Curable Composition Containing Silicone, and Cured Product Thereof CENTRAL GLASS COMPANY, LIMITED (JP) 2015-11-12 US disclosed
WO-2009051443-A2 PHOTOACTIVE COMPOSITION COMPRISING SCORIA AND PREPARATION METHOD THEREOF NURIDLE CO., LTD. (KR) 2009-04-23 WO disclosed
US-5622784-A WATERPROOFING; MODIFIED SILICON DIOXIDE THIN FILM SEIKO EPSON CORPORATION (JP) 1997-04-22 US disclosed