SCHEMBL4176679

SCHEMBL4176679

NC(=O)NN[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21785 0.80
Urea SCHEMBL11078143 0.76 ALDH1A1 (0.60)
Ammonia Solution, Strong SCHEMBL28971513 0.76
SCHEMBL9056052 0.76
SCHEMBL17220674 0.76
SCHEMBL592886 0.74
SCHEMBL28996297 0.73
SCHEMBL134446 0.72
SCHEMBL8021558 0.71
SCHEMBL7356906 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117511405-A Functional protective coating and preparation method thereof 中国科学院兰州化学物理研究所 2024-02-06 CN claimed
CN-117186774-A High-temperature radiation refrigeration coating with protection function and preparation method thereof 中国科学院兰州化学物理研究所 2023-12-08 CN claimed
CN-113497361-B Patterned SiC microstructure and application thereof 东莞理工学院 2023-10-13 CN claimed
CN-103403112-B Composition for forming low refractive index film, method for forming low refractive index film, low refractive index film formed by the method, and antireflection film 默克专利有限公司 2016-06-22 CN claimed
CN-103403112-A Composition for forming low refractive index film, method for forming low refractive index film, low refractive index film formed by the method, and antireflection film AZ ELECTRONIC MATERIALS IP JAPAN K K 2013-11-20 CN claimed
CN-100390970-C Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification IBM (US) 2008-05-28 CN claimed
CN-100349732-C Thermally stable, moisture curable polysilazanes and polysiloxazanes KION CORP (CH) 2007-11-21 CN claimed
CN-1695242-A Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification IBM (US) 2005-11-09 CN claimed
CN-1630578-A Thermally stable, moisture curable polysilazanes and polysiloxazanes KION CORP (US) 2005-06-22 CN claimed
EP-1412445-A4 POLYSILAZANE-MODIFIED POLYAMINE HARDENERS FOR EPOXY RESINS KION CORP (US) 2004-10-27 EP claimed
EP-1412445-A1 POLYSILAZANE-MODIFIED POLYAMINE HARDENERS FOR EPOXY RESINS Kion Corporation (US) 2004-04-28 EP claimed
WO-2003008514-A1 POLYSILAZANE-MODIFIED POLYAMINE HARDENERS FOR EPOXY RESINS KION CORPORATION (US) 2003-01-30 WO claimed
WO-1998051981-A1 GLASS FIBER REINFORCED CERAMIC MOLDING COMPOSITIONS OWENS CORNING (US) 1998-11-19 WO claimed
CN-118251281-A Alloy composition 赫格纳斯公司 2024-06-25 CN disclosed
US-11993546-B2 Ceramic matrix composites, and methods and systems for making same LANCER SYSTEMS LP (US) 2024-05-28 US disclosed
CN-117511405-A Functional protective coating and preparation method thereof 中国科学院兰州化学物理研究所 2024-02-06 CN disclosed
CN-1630578-A Thermally stable, moisture curable polysilazanes and polysiloxazanes KION CORP (US) 2005-06-22 CN disclosed
EP-1412445-A4 POLYSILAZANE-MODIFIED POLYAMINE HARDENERS FOR EPOXY RESINS KION CORP (US) 2004-10-27 EP disclosed
EP-1412445-A1 POLYSILAZANE-MODIFIED POLYAMINE HARDENERS FOR EPOXY RESINS Kion Corporation (US) 2004-04-28 EP disclosed
WO-2003008514-A1 POLYSILAZANE-MODIFIED POLYAMINE HARDENERS FOR EPOXY RESINS KION CORPORATION (US) 2003-01-30 WO disclosed