Trimethylammonium

Trimethylammonium

SCHEMBL4186687

B.CN(C)C.[Al]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103972149-B The method of metal filled trench 中芯国际集成电路制造(上海)有限公司 2016-08-10 CN disclosed
CN-103972149-A Method for filling groove with metal SEMICONDUCTOR MFG INT SHANGHAI 2014-08-06 CN disclosed
US-20090081863-A1 METHOD OF FORMING METAL WIRING LAYER OF SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-03-26 US disclosed
US-7470612-B2 Method of forming metal wiring layer of semiconductor device SAMSUNG ELECTRONICS CO, LTD. (KR) 2008-12-30 US disclosed
US-20070059925-A1 Method of forming metal wiring layer of semiconductor device SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-03-15 US disclosed