⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29043277 | 0.82 | — | — | |
| SCHEMBL28710942 | 0.82 | — | — | |
| SCHEMBL3795662 | 0.82 | — | — | |
| SCHEMBL2044172 | 0.82 | — | — | |
| SCHEMBL5407684 | 0.82 | — | — | |
| SCHEMBL23039583 | 0.82 | — | — | |
| SCHEMBL16323415 | 0.82 | — | — | |
| SCHEMBL15795475 | 0.82 | — | — | |
| Hydrogen Sulfide SCHEMBL22390786 | 0.82 | — | — | |
| SCHEMBL28831760 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 418 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4609015-B1 | METHOD OF ELECTROCHEMICAL CONVERSION OF AQUEOUS SOLUTIONS OF CARBONATES, BICARBONATES, CO2, C2-C5 ACIDS, SALTS OF C2-C5 ACIDS AND MIXTURES THEREOF | USTAV CHEMICKYCH PROCESU AV CR V V I (CZ) | 2026-05-06 | — | — | EP | claimed |
| US-12538781-B2 | Method of manufacturing integrated circuit device with bonding structure | NANYA TECHNOLOGY CORPORATION (TW) | 2026-01-27 | — | — | US | claimed |
| US-20250357201-A1 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | WINBOND ELECTRONICS CORP. (TW) | 2025-11-20 | — | — | US | claimed |
| EP-4609015-A2 | METHOD OF ELECTROCHEMICAL CONVERSION OF AQUEOUS SOLUTIONS OF CARBONATES, BICARBONATES, CO2, C2-C5 ACIDS, SALTS OF C2-C5 ACIDS AND MIXTURES THEREOF | Ustav Chemickych Procesu AV CR, V.V.I. (CZ) | 2025-09-03 | — | — | EP | claimed |
| CN-119464984-A | Preparation method of heterostructure copper-germanium alloy | 昆明理工大学 | 2025-02-18 | — | — | CN | claimed |
| CN-119411202-A | Standard modularized oversized cathode roller and manufacturing method | 西安泰金新能科技股份有限公司 | 2025-02-11 | — | — | CN | claimed |
| US-12159831-B2 | Method of manufacturing integrated circuit device with bonding structure | NANYA TECHNOLOGY CORPORATION (TW) | 2024-12-03 | — | — | US | claimed |
| CN-114571130-B | Preparation method of welding material for welding copper and nonmetallic substrate and welding lug | 祥博传热科技股份有限公司 | 2024-07-09 | — | — | CN | claimed |
| WO-2024088453-A2 | METHOD OF ELECTROCHEMICAL CONVERSION OF AQUEOUS SOLUTIONS OF CARBONATES, BICARBONATES, CO2, C2-C5 ACIDS, SALTS OF C2-C5 ACIDS AND MIXTURES THEREOF | USTAV CHEMICKYCH PROCESU AV CR, V. V. I. (CZ) | 2024-05-02 | — | — | WO | claimed |
| US-20240088020-A1 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE WITH BONDING STRUCTURE | NANYA TECHNOLOGY CORPORATION (TW) | 2024-03-14 | — | — | US | claimed |
| US-6339029-B1 | Method to form copper interconnects | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) | 2002-01-15 | — | — | US | claimed |
| CN-1319893-A | Electric capacitor structure and method for making same | IBM (US) | 2001-10-31 | — | — | CN | claimed |
| US-20010023987-A1 | Method for improving adhesion to copper | GLOBALFOUNDRIES U.S. INC. | 2001-09-27 | — | — | US | claimed |
| US-6271595-B1 | IN SEMICONDUCTOR DEVICES PROVIDED WITH AN INTERVENING LAYER OF GERMANIUM OXIDE, COPPER (WIRE), COPPER GERMANIDE AND/OR GERMANIUM NITRIDE BETWEEN THE COPPER AND DIELECTRIC LAYER OF SILICON OXIDE OR NITRIDE | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2001-08-07 | — | — | US | claimed |
| US-6255734-B1 | Passivated copper line semiconductor device structure | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) | 2001-07-03 | — | — | US | claimed |
| US-6181013-B1 | Method for selective growth of Cu3Ge or Cu5Si for passivation of damascene copper structures and device manufactured thereby | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) | 2001-01-30 | — | — | US | claimed |
| US-6143657-A | SELECTIVELY GROWING COPPER GERMANIDE COMPOUND AS DEPOSIT ON BOTTOM OF CONTACT HOLE, FORMING BARRIER LAYER OVER COPPER GERMANIDE, FORMING COPPER PLUG THEREOVER | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) | 2000-11-07 | — | — | US | claimed |
| CN-1269606-A | Method for improving copper adhesion | INTERNAT BUSINESS MACHIENS CO (US) | 2000-10-11 | — | — | CN | claimed |
| US-6130162-A | Method of preparing passivated copper line and device manufactured thereby | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) | 2000-10-10 | — | — | US | claimed |
| US-6046108-A | Method for selective growth of Cu3 Ge or Cu5 Si for passivation of damascene copper structures and device manufactured thereby | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) | 2000-04-04 | — | — | US | claimed |