⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28071780 | 0.87 | — | — | |
| SCHEMBL27678952 | 0.87 | — | — | |
| Hydrogen Sulfide SCHEMBL9854479 | 0.87 | — | — | |
| SCHEMBL1549809 | 0.82 | — | — | |
| SCHEMBL419396 | 0.82 | — | — | |
| SCHEMBL30851208 | 0.82 | — | — | |
| SCHEMBL235882 | 0.82 | — | — | |
| SCHEMBL30434860 | 0.82 | — | — | |
| SCHEMBL2246538 | 0.82 | — | — | |
| SCHEMBL6902161 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119073667-A | Heating element, atomizing device and preparation method of heating element | 深圳市基克纳科技有限公司 | 2024-12-06 | — | — | CN | claimed |
| CN-119054978-A | Heating element, heater and preparation method thereof | 深圳市基克纳科技有限公司 | 2024-12-03 | — | — | CN | claimed |
| CN-118902185-A | Heating element assembly and preparation method thereof | 深圳市基克纳科技有限公司 | 2024-11-08 | — | — | CN | claimed |
| CN-115466877-B | Germanium-manganese-copper alloy for manufacturing precise resistor | 重庆川仪自动化股份有限公司 | 2023-10-20 | — | — | CN | claimed |
| CN-115466877-A | Germanium manganese copper alloy for manufacturing precision resistor | 重庆川仪自动化股份有限公司 | 2022-12-13 | — | — | CN | claimed |
| CN-119506627-A | Low-resistance temperature coefficient precision resistance alloy and manufacturing method thereof | 江西宝顺昌超合金股份有限公司 | 2025-02-25 | — | — | CN | disclosed |
| CN-119073667-A | Heating element, atomizing device and preparation method of heating element | 深圳市基克纳科技有限公司 | 2024-12-06 | — | — | CN | disclosed |
| CN-119054978-A | Heating element, heater and preparation method thereof | 深圳市基克纳科技有限公司 | 2024-12-03 | — | — | CN | disclosed |
| CN-118902185-A | Heating element assembly and preparation method thereof | 深圳市基克纳科技有限公司 | 2024-11-08 | — | — | CN | disclosed |
| CN-115466877-B | Germanium-manganese-copper alloy for manufacturing precise resistor | 重庆川仪自动化股份有限公司 | 2023-10-20 | — | — | CN | disclosed |
| CN-115466877-B | Germanium-manganese-copper alloy for manufacturing precise resistor | 重庆川仪自动化股份有限公司 | 2023-10-20 | — | — | CN | disclosed |
| CN-115466877-B | Germanium-manganese-copper alloy for manufacturing precise resistor | 重庆川仪自动化股份有限公司 | 2023-10-20 | — | — | CN | disclosed |
| CN-101673602-A | Resistor element and method for manufacturing the same | CYNTEC CO LTD | 2010-03-17 | — | — | CN | disclosed |
| CN-100478470-C | Precise resistive Cu-Mn-Ga-Ge alloy and preparation method thereof | GUIYAN PLATINUM INDUSTRY CO LTD (CN) | 2009-04-15 | — | — | CN | disclosed |
| CN-101020974-A | Precise resistive Cu-Mn-Ga-Ge alloy | GUIYAN PLATINUM INDUSTRY CO LTD (CN) | 2007-08-22 | — | — | CN | disclosed |
| US-7238296-B2 | Resistive composition, resistor using the same, and making method thereof | KOA KABUSHIKI KAISHA (JP) | 2007-07-03 | — | — | US | disclosed |
| CN-1312703-C | Resistance composition, electrical resistor using said composition and its mfg. method | SINYA CO LTD (JP) | 2007-04-25 | — | — | CN | disclosed |
| JP-2006019323-A | RESISTANCE COMPOSITION, CHIP RESISTOR AND THEIR MANUFACTURING METHOD | KOA CORP | 2006-01-19 | — | — | JP | disclosed |
| CN-1495804-A | Resistance composition, electrical resistor using said composition and its mfg. method | 兴亚株式会社 | 2004-05-12 | — | — | CN | disclosed |
| US-20040051085-A1 | Resistive composition, resistor using the same, and making method thereof | KOA KABUSHIKI KAISHA (JP) | 2004-03-18 | — | — | US | disclosed |