SCHEMBL424403

SCHEMBL424403

OB(O)Oc1cccc2ccc3cc4ccccc4cc3c12.c1ccc([PH](c2ccccc2)(c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.34

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ERBB2 P04626 1/20 0.34
CYP1A2 P05177 1/20 0.34
FYN P06241 1/20 0.34
MAOA P21397 1/20 0.34
ACHE P22303 1/20 0.34
AHR P35869 1/20 0.34
KDM4E B2RXH2 2/20 0.32
ALDH1A1 P00352 2/20 0.32
GAA P10253 2/20 0.32
RXRA P19793 1/20 0.32
PPARG P37231 1/20 0.32
PPARD Q03181 1/20 0.32
PPARA Q07869 1/20 0.32
MEN1 O00255 1/20 0.30
MAPT P10636 1/20 0.30
KMT2A Q03164 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7639377 0.90 CYP1A2 (0.33) ERBB2CYP1A2FYNMAOAACHE
SCHEMBL19259375 0.90 CYP1A2 (0.41) ERBB2CYP1A2FYNMAOAACHE
SCHEMBL7641006 0.90 RXRA (0.33) ERBB2CYP1A2FYNMAOAACHE
SCHEMBL7643793 0.90 RXRA (0.33) ERBB2CYP1A2FYNMAOAACHE
SCHEMBL7639347 0.90 RXRA (0.33) ERBB2CYP1A2FYNMAOAACHE
SCHEMBL1314570 0.89 CYP1A2 (0.40) ERBB2CYP1A2FYNMAOAACHE
Hydrogen Sulfide SCHEMBL17372873 0.89 CYP1A2 (0.40) ERBB2CYP1A2FYNMAOAACHE
Phosphine SCHEMBL3288817 0.89 CYP1A2 (0.40) ERBB2CYP1A2FYNMAOAACHE
SCHEMBL911163 0.89 CYP1A2 (0.40) ERBB2CYP1A2FYNMAOAACHE
Ammonia Solution, Strong SCHEMBL1035827 0.89 CYP1A2 (0.40) ERBB2CYP1A2FYNMAOAACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 369 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107849417-B Adhesive composition, cured product, semiconductor device, and method for producing same 昭和电工材料株式会社 2021-06-29 CN claimed
US-20030207117-A1 Sheet resin composition and process for manufacturing semiconductor device therewith AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD. (SG) 2003-11-06 US claimed
US-6620862-B2 Semiconductors; polymer adhesion to silicon wafer AMKOR TECHNOLOGY, INC. 2003-09-16 US claimed
US-20020001688-A1 Sheet resin composition and process for manufacturing semiconductor device therewith AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD. (SG) 2002-01-03 US claimed
US-6316575-B1 MELT TRANSESTERIFICATION OF DIOL COMPOUND AND CARBOANTE COMPOUND USING CATALYST COMPRISING A PHOSPHORUS-CONTAINING BASIC COMPOUND QUATERNARY PHOSPHONIUM SALT TO FORM POLYCARBONATE IDEMITSU KOSAN CO., LTD. (JP) 2001-11-13 US claimed
JP-6228280-A None JP disclosed
JP-7330787-A None JP disclosed
JP-11049842-A None JP disclosed
JP-61113614-A None JP disclosed
JP-6228279-A None JP disclosed
WO-2026100731-A1 COMPOSITION FOR OPTICAL MATERIAL, POLYMERIZABLE COMPOSITION FOR OPTICAL MATERIAL, OPTICAL MATERIAL, AND LENS 三井化学株式会社 2026-05-15 WO disclosed
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
EP-0687703-A2 Fiber-reinforced resin plate and process for producing the same KASHIMA OIL CO., LTD (JP) 1995-12-20 EP disclosed
JP-H07330787-A SYNTHESIS OF TETRASUBSTITUTED PHOSPHONIUM ORGANIC ACID SALT SUMITOMO BAKELITE CO LTD 1995-12-19 JP disclosed
JP-H06228280-A CURING AGENT FOR EPOXY RESIN COMPOSITION, EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SHIN ETSU CHEM CO LTD 1994-08-16 JP disclosed
JP-H06228279-A CURING AGENT FOR EPOXY RESIN COMPOSITION, EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SHIN ETSU CHEM CO LTD 1994-08-16 JP disclosed
US-5134204-A Polymaleimide, Polyepoxide, Phenolic Compound MITSUI TOATSU CHEMICALS, INC. (JP) 1992-07-28 US disclosed
EP-0397395-A2 Resin composition for sealing semiconductors MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-11-14 EP disclosed
EP-0397396-A2 Resin composition for sealing semiconductors MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-11-14 EP disclosed
JP-S61113614-A EPOXY RESIN COMPOSITION HITACHI CHEM CO LTD 1986-05-31 JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L ERBB2 2104/4885CYP1A2 1387/4885FYN 1923/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.