Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ACHE | P22303 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28663935 | 0.96 | ACHE (0.36) | ACHE | |
| Potassium Ion SCHEMBL28670568 | 0.96 | ACHE (0.36) | ACHE | |
| SCHEMBL28649764 | 0.96 | ACHE (0.36) | ACHE | |
| SCHEMBL30835200 | 0.96 | ACHE (0.36) | ACHE | |
| Zinc Ion SCHEMBL1395725 | 0.96 | ACHE (0.36) | ACHE | |
| SCHEMBL21963289 | 0.96 | ACHE (0.36) | ACHE | |
| Phosphoric Acid SCHEMBL28676178 | 0.91 | ACHE (0.41) | ACHE | |
| SCHEMBL5449723 | 0.74 | ACHE (0.37) | ACHE | |
| SCHEMBL3074721 | 0.74 | ACHE (0.37) | ACHE | |
| SCHEMBL3085063 | 0.73 | ACHE (0.36) | ACHE |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10662321-B2 | Cyclic olefin copolymer composition and cross-linked product thereof | MITSUI CHEMICALS, INC. (JP) | 2020-05-26 | — | — | US | disclosed |
| CN-109130391-A | Resin film for laminated glass, and process for producing the same | SKC株式会社 | 2019-01-04 | — | — | CN | disclosed |
| EP-1199613-B1 | Method for removing deposit from image substrate and image formation apparatus using the method | RICOH CO LTD (JP) | 2015-12-09 | — | — | EP | disclosed |
| US-8831467-B2 | Image-forming apparatus | RICOH COMPANY, LTD. (JP) | 2014-09-09 | — | — | US | disclosed |
| EP-2730953-A1 | MOLDED ARTICLE, MOLDING MATERIAL, OPTICAL COMPONENT, AND METHOD FOR PRODUCING MOLDING MATERIAL | Mitsui Chemicals, Inc. (JP) | 2014-05-14 | — | — | EP | disclosed |
| US-20140114003-A1 | MOLDED PRODUCT, MOLDING MATERIAL, OPTICAL COMPONENT, AND METHOD OF PRODUCING MOLDING MATERIAL | MITSUI CHEMICALS, INC. (JP) | 2014-04-24 | — | — | US | disclosed |
| EP-1271259-B1 | Image forming apparatus and process cartridge therefor | RICOH CO LTD (JP) | 2013-11-20 | — | — | EP | disclosed |
| US-8586270-B2 | Electrophotographic photoconductor, electrophotographic method, and electrophotographic apparatus | RICOH COMPANY, LTD. (JP) | 2013-11-19 | — | — | US | disclosed |
| US-20120251934-A1 | ELECTROPHOTOGRAPHIC PHOTOCONDUCTOR, ELECTROPHOTOGRAPHIC METHOD, AND ELECTROPHOTOGRAPHIC APPARATUS | RICOH COMPANY, LTD. (JP) | 2012-10-04 | — | — | US | disclosed |
| US-20120237250-A1 | IMAGE-FORMING APPARATUS | RICOH COMPANY, LTD. (JP) | 2012-09-20 | — | — | US | disclosed |
| EP-1199613-A2 | Method for removing deposit from image substrate and image formation apparatus using the method | Ricoh Company, Ltd. (JP) | 2002-04-24 | — | — | EP | disclosed |
| US-20020037189-A1 | Method for removing deposit from image substrate and image formation apparatus using the method | RICOH COMPANY, LTD. (JP) | 2002-03-28 | — | — | US | disclosed |
| US-5716443-A | MIXTURES OF POLYDIMETHYLSILOXANE, ANOTHER POLYSILOXANE HAVING MONOMERS CONTAINING AMINOALKYL GROUPS, ORGANIC ACIDS AND AQUEOUS ORGANIC SOLVENTS | TAIHO INDUSTRIES, CO., LTD. (JP) | 1998-02-10 | — | — | US | disclosed |
| EP-0437374-B1 | Optical molding resin composition | ASAHI DENKA KOGYO KK (JP) | 1996-12-27 | — | — | EP | disclosed |
| EP-0439258-B1 | Actinic radiation-reactive pressure-sensitive adhesive composition | ASAHI DENKA KOGYO KK (JP) | 1995-05-03 | — | — | EP | disclosed |
| US-5360873-A | Acrylate copolymer, polythiol compound and polyene compound, mounting semiconductor wafers | ASAHI DENKA KOGYO K.K. (JP) | 1994-11-01 | — | — | US | disclosed |
| US-5278199-A | Comprising polythiol compounds and polyene compounds | ASAHI DENKA KOGYO K.K. (JP) | 1994-01-11 | — | — | US | disclosed |
| US-5236967-A | Optical molding resin composition comprising polythiol-polyene compounds | ASAHI DENKA KOGYO K.K. (JP) | 1993-08-17 | — | — | US | disclosed |
| EP-0439258-A2 | Actinic radiation-reactive pressure-sensitive adhesive composition | ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) | 1991-07-31 | — | — | EP | disclosed |
| EP-0437374-A2 | Optical molding resin composition | ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) | 1991-07-17 | — | — | EP | disclosed |