⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4250358 | 0.77 | — | — | |
| SCHEMBL58991 | 0.77 | — | — | |
| SCHEMBL5694299 | 0.72 | — | — | |
| SCHEMBL231812 | 0.72 | — | — | |
| SCHEMBL5198119 | 0.72 | — | — | |
| SCHEMBL10527152 | 0.72 | — | — | |
| SCHEMBL1937424 | 0.72 | — | — | |
| SCHEMBL4808929 | 0.72 | — | — | |
| SCHEMBL22471926 | 0.69 | — | — | |
| SCHEMBL18108169 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119081643-A | Low-viscosity high-heat-conductivity organic silicon bonding pouring sealant and preparation method thereof | 硅宝正基(深圳)科技有限公司 | 2024-12-06 | — | — | CN | claimed |
| CN-119081643-A | Low-viscosity high-heat-conductivity organic silicon bonding pouring sealant and preparation method thereof | 硅宝正基(深圳)科技有限公司 | 2024-12-06 | — | — | CN | disclosed |
| CN-108862304-B | Hydrophobic hybrid silicon-aluminum molecular sieve containing organic groups and having micro-nano hierarchical structure and preparation method thereof | 武汉理工大学 | 2022-02-18 | — | — | CN | disclosed |
| EP-1970421-B1 | COATING LIQUID FOR FORMING LOW DIELECTRIC CONSTANT AMORPHOUS SILICA COATING FILM AND LOW DIELECTRIC CONSTANT AMORPHOUS SILICA COATING FILM OBTAINED FROM SUCH COATING LIQUID | JGC CATALYSTS & CHEMICALS LTD (JP) | 2015-04-29 | — | — | EP | disclosed |
| US-20130280654-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE CURED FILM | SUMITOMO BAKELITE CO (JP) | 2013-10-24 | — | — | US | disclosed |
| US-8492469-B2 | Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured film | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-07-23 | — | — | US | disclosed |
| US-20110136952-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE CURED FILM | SUMITOMO BAKELITE CO., LTD. (JP) | 2011-06-09 | — | — | US | disclosed |
| US-20090025609-A1 | Coating Liquid for Forming Low Dielectric Constant Amorphous Silica-Based Coating Film and the Coating Film Obtained From the Same | JGC CATALYSTS AND CHEMICALS LTD. (JP) | 2009-01-29 | — | — | US | disclosed |
| EP-1970421-A1 | COATING LIQUID FOR FORMING LOW DIELECTRIC CONSTANT AMORPHOUS SILICA COATING FILM AND LOW DIELECTRIC CONSTANT AMORPHOUS SILICA COATING FILM OBTAINED FROM SUCH COATING LIQUID | CATALYSTS & CHEMICALS INDUSTRIES CO., LTD. (JP) | 2008-09-17 | — | — | EP | disclosed |
| US-4788311-A | Novel organosilicon compounds useful as a stabilizer for organopolysiloxane compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1988-11-29 | — | — | US | disclosed |