SCHEMBL4250299

SCHEMBL4250299

Cc1ccccc1C(=O)Oc1cccc(O)c1

nearest known ligand 0.69

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 6/20 0.69
MEN1 O00255 5/20 0.69
NPC1 O15118 1/20 0.69
CASP3 P42574 1/20 0.69
SENP8 Q96LD8 1/20 0.69
SENP7 Q9BQF6 1/20 0.69
SENP6 Q9GZR1 1/20 0.69
MAPT P10636 4/20 0.58
LMNA P02545 1/20 0.58
CYP3A4 P08684 1/20 0.57
HTT P42858 1/20 0.55
ESR1 P03372 6/20 0.55
ESR2 Q92731 5/20 0.55
ALOX15 P16050 2/20 0.49
HSD17B10 Q99714 2/20 0.49
HPGD P15428 1/20 0.49
CYP1A2 P05177 2/20 0.48
CYP2C19 P33261 2/20 0.48
CYP2C9 P11712 1/20 0.48
MAPK1 P28482 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29576345 1.00 KMT2A (0.69) KMT2AMEN1NPC1CASP3SENP8
SCHEMBL11663752 0.90 KMT2A (0.63) KMT2AMEN1NPC1CASP3SENP8
SCHEMBL29217291 0.89 KMT2A (0.56) KMT2AMEN1NPC1CASP3SENP8
SCHEMBL10782945 0.88 CYP3A4 (0.61) KMT2AMEN1NPC1CASP3SENP8
SCHEMBL8208866 0.83 HPGD (0.71) KMT2AMEN1NPC1CASP3SENP8
SCHEMBL11198336 0.83 CYP3A4 (0.59) KMT2AMEN1NPC1CASP3SENP8
SCHEMBL1254116 0.83 KMT2A (0.64) KMT2AMEN1NPC1CASP3SENP8
SCHEMBL2470998 0.82 ALOX15 (0.54) KMT2AMEN1NPC1CASP3SENP8
SCHEMBL10445206 0.81 KMT2A (0.82) KMT2AMEN1NPC1CASP3SENP8
SCHEMBL7752774 0.81 KMT2A (0.55) KMT2AMEN1NPC1CASP3SENP8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106999382-A Hair deformation process agent 花王株式会社 2017-08-01 CN disclosed
CN-102295896-B Heat-sensitive adhesive material RICOH CO LTD 2015-01-14 CN disclosed
EP-2397531-B1 Heat-sensitive adhesive material RICOH CO LTD (JP) 2012-10-31 EP disclosed
CN-101143997-B Heat-sensitive adhesive agent and heat-sensitive adhesive sheet RICOH CO LTD 2012-09-26 CN disclosed
EP-2014688-B1 Thermosensitive adhesive material RICOH CO LTD (JP) 2012-05-30 EP disclosed
EP-2072597-A1 Heat-Sensitive Adhesive and Heat-Sensitive Adhesive Material Ricoh Company, Ltd. (JP) 2009-06-24 EP disclosed
US-20090155569-A1 HEAT-SENSITIVE ADHESIVE, AND HEAT-SENSITIVE ADHESIVE MATERIAL RICOH COMPANY, LTD (JP) 2009-06-18 US disclosed
US-20090017299-A1 THERMOSENSITIVE ADHESIVE MATERIAL RICOH COMPANY, LTD (JP) 2009-01-15 US disclosed
EP-2014688-A1 Thermosensitive adhesive material Ricoh Company, Ltd. (JP) 2009-01-14 EP disclosed
CN-101143997-A Heat-sensitive adhesive agent and heat-sensitive adhesive sheet RICOH KK (JP) 2008-03-19 CN disclosed