SCHEMBL425167

SCHEMBL425167

CCCO[Ti](OCCC)OCCC.CCOC(=O)CC(C)=O

nearest known ligand 0.52

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
GAA P10253 4/20 0.52
MGAM O43451 2/20 0.52
SI P14410 2/20 0.52
MGAM2 Q2M2H8 2/20 0.52
ALDH1A1 P00352 7/20 0.39
TRPA1 O75762 1/20 0.39
HSD17B10 Q99714 2/20 0.38
LMNA P02545 2/20 0.38
CYP1A2 P05177 1/20 0.34
KDM4E B2RXH2 2/20 0.34
PKM P14618 1/20 0.34
MAPT P10636 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33
ALOX15 P16050 1/20 0.33
TSHR P16473 1/20 0.33
FAAH O00519 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL427688 0.89 GAA (0.48) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL1697722 0.86 GAA (0.58) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL2590661 0.86 GAA (0.58) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL1331762 0.83
SCHEMBL1331782 0.83
SCHEMBL1330478 0.83
SCHEMBL1871576 0.83 GAA (0.74) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL1332259 0.83
SCHEMBL15500 0.83
SCHEMBL1330988 0.83

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114502629-B Safety tyre 株式会社普利司通 2024-12-24 CN disclosed
US-20220155688-A1 ALKALINE DEVELOPER SOLUABLE SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2022-05-19 US disclosed
US-20210124266-A1 PRIMER FOR SEMICONDUCTOR SUBSTRATE AND METHOD FOR FORMING A PATTERN NISSAN CHEMICAL CORPORATION (JP) 2021-04-29 US disclosed
US-20200225584-A1 ALKALINE DEVELOPER SOLUABLE SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2020-07-16 US disclosed
US-10613440-B2 Silicon-containing EUV resist underlayer film-forming composition containing onium sulfonate NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2020-04-07 US disclosed
US-9627217-B2 Silicon-containing EUV resist underlayer film-forming composition including additive NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2017-04-18 US disclosed
US-9196484-B2 Silicon-containing composition for formation of resist underlayer film, which contains organic group containing protected aliphatic alcohol NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2015-11-24 US disclosed
US-20150210829-A1 SILICON-CONTAINING EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING ONIUM SULFONATE NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2015-07-30 US disclosed
EP-2881794-A1 COMPOSITION FOR FORMING UNDERLAYER FILM FOR SILICON-CONTAINING EUV RESIST AND CONTAINING ONIUM SULFONATE Nissan Chemical Industries, Ltd. (JP) 2015-06-10 EP disclosed
US-20150079792-A1 SILICON-CONTAINING EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION INCLUDING ADDITIVE NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2015-03-19 US disclosed
EP-1298176-A2 Stacked film insulating film and substrate for semiconductor JSR Corporation (JP) 2003-04-02 EP disclosed
US-20030059550-A1 Method of film formation, insulating film, and substrate for semiconductor JSR CORPORATION (JP) 2003-03-27 US disclosed
US-20030059628-A1 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor JSR CORPORATION (JP) 2003-03-27 US disclosed
EP-1296365-A2 Method of film formation, insulating film, and substrate for semiconductor JSR Corporation (JP) 2003-03-26 EP disclosed
EP-1295924-A2 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor JSR Corporation (JP) 2003-03-26 EP disclosed
US-20030008155-A1 Method for the formation of silica film, silica film, insulating film, and semiconductor device JSR CORPORATION (JP) 2003-01-09 US disclosed
EP-1267395-A2 Method for the formation of silica film, silica film, insulating film, and semiconductor device JSR Corporation (JP) 2002-12-18 EP disclosed
US-6472079-B2 PRODUCT OF HYDROLYSIS AND CONDENSATION OF AN ORGANOSILICON COMPOUND; 1A OR 2A COMPOUND, ESPECIALLY CARBOXYLIC SALT; SOLVENT; EXCELLENT CRACKING RESISTANCE AFTER A PCT (PRESSURE COOKER TEST). JSR CORPORATION (JP) 2002-10-29 US disclosed
US-20020045693-A1 Composition for film formation, method of film formation and silica-based film JSR CORPORATION (JP) 2002-04-18 US disclosed
EP-1148105-A2 Composition for film formation, method of film formation, and silica-based film JSR Corporation (JP) 2001-10-24 EP disclosed