SCHEMBL427688

SCHEMBL427688

CCCCO[Ti](OCCCC)OCCCC.CCOC(=O)CC(C)=O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 3/20 0.48
MGAM O43451 2/20 0.48
SI P14410 2/20 0.48
MGAM2 Q2M2H8 2/20 0.48
ALDH1A1 P00352 4/20 0.44
TSHR P16473 3/20 0.39
HPGD P15428 1/20 0.39
FAAH O00519 1/20 0.38
ATM Q13315 2/20 0.37
TRPA1 O75762 1/20 0.36
NAAA Q02083 1/20 0.36
DGKA P23743 1/20 0.36
CYP1A2 P05177 1/20 0.36
L3MBTL1 Q9Y468 2/20 0.36
TDP1 Q9NUW8 1/20 0.36
LMNA P02545 1/20 0.35
HSD17B10 Q99714 1/20 0.35
MAPK1 P28482 1/20 0.35
CES2 O00748 1/20 0.35
ACHE P22303 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL425167 0.89 GAA (0.52) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL21753733 0.87 MGAM (0.54) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL21543979 0.85 MGAM (0.58) GAAMGAMSIMGAM2ALDH1A1
Acetic Acid Butyl Ester SCHEMBL29539673 0.84 ALDH1A1 (0.67) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL2590661 0.83 GAA (0.58) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL487722 0.82 GAA (0.48) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL431559 0.82 GAA (0.48) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL27734875 0.82 GAA (0.48) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL453161 0.82 GAA (0.48) GAAMGAMSIMGAM2ALDH1A1
SCHEMBL1361380 0.82 GAA (0.48) GAAMGAMSIMGAM2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114502629-B Safety tyre 株式会社普利司通 2024-12-24 CN disclosed
US-20220155688-A1 ALKALINE DEVELOPER SOLUABLE SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2022-05-19 US disclosed
US-20210124266-A1 PRIMER FOR SEMICONDUCTOR SUBSTRATE AND METHOD FOR FORMING A PATTERN NISSAN CHEMICAL CORPORATION (JP) 2021-04-29 US disclosed
US-10886072-B2 Method for producing photoelectric conversion element SHARP KABUSHIKI KAISHA (JP) 2021-01-05 US disclosed
US-20200225584-A1 ALKALINE DEVELOPER SOLUABLE SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2020-07-16 US disclosed
US-10613440-B2 Silicon-containing EUV resist underlayer film-forming composition containing onium sulfonate NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2020-04-07 US disclosed
US-20190348226-A1 METHOD FOR PRODUCING PHOTOELECTRIC CONVERSION ELEMENT SHARP KABUSHIKI KAISHA (JP) 2019-11-14 US disclosed
US-9627217-B2 Silicon-containing EUV resist underlayer film-forming composition including additive NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2017-04-18 US disclosed
US-9196484-B2 Silicon-containing composition for formation of resist underlayer film, which contains organic group containing protected aliphatic alcohol NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2015-11-24 US disclosed
US-20150210829-A1 SILICON-CONTAINING EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING ONIUM SULFONATE NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2015-07-30 US disclosed
EP-1298176-A2 Stacked film insulating film and substrate for semiconductor JSR Corporation (JP) 2003-04-02 EP disclosed
US-20030059550-A1 Method of film formation, insulating film, and substrate for semiconductor JSR CORPORATION (JP) 2003-03-27 US disclosed
US-20030059628-A1 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor JSR CORPORATION (JP) 2003-03-27 US disclosed
EP-1296365-A2 Method of film formation, insulating film, and substrate for semiconductor JSR Corporation (JP) 2003-03-26 EP disclosed
EP-1295924-A2 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor JSR Corporation (JP) 2003-03-26 EP disclosed
US-20030008155-A1 Method for the formation of silica film, silica film, insulating film, and semiconductor device JSR CORPORATION (JP) 2003-01-09 US disclosed
EP-1267395-A2 Method for the formation of silica film, silica film, insulating film, and semiconductor device JSR Corporation (JP) 2002-12-18 EP disclosed
US-6472079-B2 PRODUCT OF HYDROLYSIS AND CONDENSATION OF AN ORGANOSILICON COMPOUND; 1A OR 2A COMPOUND, ESPECIALLY CARBOXYLIC SALT; SOLVENT; EXCELLENT CRACKING RESISTANCE AFTER A PCT (PRESSURE COOKER TEST). JSR CORPORATION (JP) 2002-10-29 US disclosed
US-20020045693-A1 Composition for film formation, method of film formation and silica-based film JSR CORPORATION (JP) 2002-04-18 US disclosed
EP-1148105-A2 Composition for film formation, method of film formation, and silica-based film JSR Corporation (JP) 2001-10-24 EP disclosed