SCHEMBL4253446

SCHEMBL4253446

CC1(C)C=C(O)CC(C)(C)N1

nearest known ligand 0.53

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
▸ SMN1; SMN2 Q16637 2/20 0.53
▸ GLA P06280 1/20 0.39
▸ KMT2A Q03164 1/20 0.39
▸ L3MBTL1 Q9Y468 1/20 0.39
▸ ALDH1A1 P00352 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5599082 0.73 SMN1; SMN2 (0.46) SMN1; SMN2GLAKMT2AL3MBTL1ALDH1A1
SCHEMBL20936054 0.71 SMN1; SMN2 (0.44) SMN1; SMN2GLAKMT2AL3MBTL1ALDH1A1
SCHEMBL19102433 0.71 SMN1; SMN2 (0.44) SMN1; SMN2GLAKMT2AL3MBTL1ALDH1A1
SCHEMBL12499138 0.71 SMN1; SMN2 (0.44) SMN1; SMN2GLAKMT2AL3MBTL1ALDH1A1
SCHEMBL20170045 0.70 SMN1; SMN2 (0.43) SMN1; SMN2GLAKMT2AL3MBTL1ALDH1A1
SCHEMBL5599103 0.70 KMT2A (0.49) SMN1; SMN2GLAKMT2AL3MBTL1ALDH1A1
SCHEMBL9998923 0.68 — —
SCHEMBL11134639 0.67 SMN1; SMN2 (0.41) SMN1; SMN2GLAKMT2AL3MBTL1ALDH1A1
SCHEMBL15329364 0.67 SMN1; SMN2 (0.41) SMN1; SMN2GLAKMT2AL3MBTL1ALDH1A1
SCHEMBL11470284 0.66 ALDH1A1 (0.52) SMN1; SMN2KMT2AALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117229586-A Polypropylene material with low surface hardness, high modulus and high strength, and preparation method and application thereof 青岛海纳新材料有限公司 2023-12-15 — — CN disclosed
CN-113548698-A Ternary hydrotalcite-like metal oxide, preparation method thereof and application of activated peroxymonosulfate in degrading organic pollutants 四川大学 2021-10-26 — — CN disclosed
EP-2105795-B1 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORP (JP) 2016-12-28 — — EP disclosed
CN-102471090-B potassium cesium tungsten bronze particles BASF SE (DE) 2015-11-25 — — CN disclosed
CN-104204057-A Stable compositions of thiabendazole and iodine-containing fungicides LANXESS DEUTSCHLAND GMBH 2014-12-10 — — CN disclosed
CN-101555006-B Preparation method of modified carbon nanotube UNIV QINGDAO 2011-09-14 — — CN disclosed
CN-101555006-A Preparation method of modified carbon nanotube UNIV QINGDAO (CN) 2009-10-14 — — CN disclosed
EP-2105795-A1 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM Corporation (JP) 2009-09-30 — — EP disclosed
Send feedback