⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Imidazole SCHEMBL3240045 | 1.00 | — | — | |
| Imidazole SCHEMBL28109905 | 0.97 | — | — | |
| Imidazole SCHEMBL28002098 | 0.97 | — | — | |
| Imidazole SCHEMBL19028065 | 0.96 | ALDH1A1 (1.00) | — | |
| Imidazole SCHEMBL2635292 | 0.96 | — | — | |
| Imidazole SCHEMBL30382963 | 0.96 | — | — | |
| Imidazole SCHEMBL28744226 | 0.96 | ALDH1A1 (1.00) | — | |
| Imidazole SCHEMBL897 | 0.96 | — | — | |
| Imidazole SCHEMBL2684565 | 0.96 | ALDH1A1 (1.00) | — | |
| Imidazole SCHEMBL1331382 | 0.96 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1178 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115458809-B | Electrolyte and lithium ion battery comprising same | 湖州昆仑亿恩科电池材料有限公司 | 2024-12-13 | — | — | CN | claimed |
| CN-117603544-A | Antibacterial and mildew-proof modified plastic and preparation method thereof | 宿迁禾润昌新材料有限公司 | 2024-02-27 | — | — | CN | claimed |
| US-11873398-B2 | Interlayer insulating material and multilayer printed wiring board | SEKISUI CHEMICAL CO., LTD. (JP) | 2024-01-16 | — | — | US | claimed |
| CN-113087740-B | Preparation method and application of organotin ionic liquid catalyst | 河南科技学院 | 2023-12-22 | — | — | CN | claimed |
| CN-116948532-A | Monocrystalline silicon fine polishing liquid and preparation method thereof | 湖北兴福电子材料股份有限公司 | 2023-10-27 | — | — | CN | claimed |
| CN-116390855-A | Resin composition, adhesive film, laminate with resin composition layer, laminate, and electromagnetic wave shielding film | 东亚合成株式会社 | 2023-07-04 | — | — | CN | claimed |
| CN-116334625-A | Copper surface microetching solution and preparation method and application thereof | 广东省科学院化工研究所 | 2023-06-27 | — | — | CN | claimed |
| CN-114773577-B | Self-assembled microcapsule epoxy resin latent curing agent and preparation method thereof | 上海大学 | 2023-06-13 | — | — | CN | claimed |
| CN-115458809-A | Electrolyte and lithium ion battery comprising same | 香河昆仑新能源材料股份有限公司 | 2022-12-09 | — | — | CN | claimed |
| US-20220306859-A1 | RESIN COMPOSITION, BONDING FILM, LAYERED BODY INCLUDING RESIN COMPOSITION LAYER, LAYERED BODY, AND ELECTROMAGNETIC WAVE SHIELDING FILM | TOAGOSEI CO., LTD. (JP) | 2022-09-29 | — | — | US | claimed |
| CN-1860253-A | Titanium or titanium alloy, resin composition for adhesion, prepreg and composite material | TORAY INDUSTRIES (JP) | 2006-11-08 | — | — | CN | claimed |
| CN-1836021-A | Adhesive composition for semiconductor device and cover lay film, adhesive sheet, and copper-clad polyimide film each made with the same | TORAY INDUSTRIES (JP) | 2006-09-20 | — | — | CN | claimed |
| EP-1679391-A1 | TITANIUM OR TITANIUM ALLOY, RESIN COMPOSITION FOR ADHESION, PREPREG AND COMPOSITE MATERIAL | TORAY INDUSTRIES, INC. (JP) | 2006-07-12 | — | — | EP | claimed |
| EP-1640428-A1 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE AND COVER LAY FILM, ADHESIVE SHEET, AND COPPER-CLAD POLYIMIDE FILM EACH MADE WITH THE SAME | TORAY INDUSTRIES, INC. (JP) | 2006-03-29 | — | — | EP | claimed |
| US-20040258921-A1 | Curing resin composition and sealants and end-sealing materials for displays | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-12-23 | — | — | US | claimed |
| CN-1509324-A | Cured resin composition, and sealant and end-capping material for display | ��Ԩ��ѧ��ҵ��ʽ���� | 2004-06-30 | — | — | CN | claimed |
| EP-1405888-A1 | CURING RESIN COMPOSITION AND SEALANTS AND END-SEALING MATERIALS FOR DISPLAYS | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-04-07 | — | — | EP | claimed |
| EP-0526847-B1 | Novel imidazole-silane compounds, process for producing the same, and metal surface finishing agent containing the same | JAPAN ENERGY CORP (JP) | 1996-01-31 | — | — | EP | claimed |
| US-5258522-A | Corrosion and heat resistance for metals | NIPPON MINING CO., LTD. (JP) | 1993-11-02 | — | — | US | claimed |
| EP-0526847-A1 | Novel imidazole-silane compounds, process for producing the same, and metal surface finishing agent containing the same | JAPAN ENERGY CORPORATION (JP) | 1993-02-10 | — | — | EP | claimed |