SCHEMBL4280106

SCHEMBL4280106

CCCCCCCCCCCSSO

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 2/20 0.47
TSHR P16473 2/20 0.47
CES2 O00748 5/20 0.44
HSD17B10 Q99714 2/20 0.44
GMNN O75496 1/20 0.44
TP53 P04637 1/20 0.44
POLB P06746 1/20 0.44
MAPT P10636 1/20 0.44
CYP2C9 P11712 1/20 0.44
BLM P54132 1/20 0.44
LMNA P02545 2/20 0.43
ALDH1A1 P00352 1/20 0.43
MEN1 O00255 1/20 0.43
KMT2A Q03164 1/20 0.43
EPHX1 P07099 1/20 0.40
CTSL P07711 1/20 0.39
CTSB P07858 1/20 0.39
CES1 P23141 6/20 0.39
FAAH O00519 4/20 0.39
PLA2G6 O60733 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4281163 1.00 THRB (0.47) THRBTSHRCES2HSD17B10GMNN
SCHEMBL18914855 0.88
SCHEMBL9330272 0.84 TSHR (0.57) THRBTSHRCES2HSD17B10GMNN
SCHEMBL10949090 0.84 TSHR (0.57) THRBTSHRCES2HSD17B10GMNN
SCHEMBL10945195 0.84 TSHR (0.57) THRBTSHRCES2HSD17B10GMNN
SCHEMBL1220054 0.84 TSHR (0.57) THRBTSHRCES2HSD17B10GMNN
SCHEMBL9329131 0.84 TSHR (0.57) THRBTSHRCES2HSD17B10GMNN
SCHEMBL1221777 0.84 TSHR (0.57) THRBTSHRCES2HSD17B10GMNN
SCHEMBL20634256 0.84 TSHR (0.57) THRBTSHRCES2HSD17B10GMNN
SCHEMBL867481 0.84 TSHR (0.57) THRBTSHRCES2HSD17B10GMNN

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12489044-B2 Method for producing layered body, layered body, and multilayered body TOYOBO CO., LTD. (JP) 2025-12-02 US disclosed
WO-2025047667-A1 SHEET MATERIAL AND METHOD FOR PRODUCING SHEET MATERIAL 東洋紡株式会社 2025-03-06 WO disclosed
US-20240153785-A1 POLYMER FILM RELEASING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND RELEASING DEVICE TOYOBO CO., LTD. (JP) 2024-05-09 US disclosed
US-20240096774-A1 METHOD FOR PRODUCING LAYERED BODY, LAYERED BODY, AND MULTILAYERED BODY TOYOBO CO., LTD. (JP) 2024-03-21 US disclosed
EP-4331816-A1 POLYMER FILM RELEASING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND RELEASING DEVICE TOYOBO CO., LTD. (JP) 2024-03-06 EP disclosed
CN-117616882-A Method for producing circuit board, circuit board precursor with release film, and circuit board precursor with inorganic substrate 东洋纺株式会社 2024-02-27 CN disclosed
US-20240059057-A1 LAMINATED FILM, LAMINATED FILM MANUFACTURING METHOD, LAMINATE, AND LAMINATE MANUFACTURING METHOD TOYOBO CO., LTD. (JP) 2024-02-22 US disclosed
EP-4302994-A1 LAMINATED FILM, LAMINATED FILM MANUFACTURING METHOD, LAMINATE, AND LAMINATE MANUFACTURING METHOD TOYOBO CO., LTD. (JP) 2024-01-10 EP disclosed
CN-117223095-A Method for peeling polymer film, method for manufacturing electronic device, and peeling apparatus 东洋纺株式会社 2023-12-12 CN disclosed
EP-4286153-A1 METHOD FOR PRODUCING LAYERED BODY, LAYERED BODY, AND MULTILAYERED BODY TOYOBO CO., LTD. (JP) 2023-12-06 EP disclosed
CN-103502005-B Laminate, method for producing same, and method for producing device structure using same TOYO BOSEKI 2015-05-06 CN disclosed
EP-2865523-A1 PROCESS FOR PRODUCING LAYERED PRODUCT, LAYERED PRODUCT, PROCESS FOR PRODUCING LAYERED PRODUCT WITH DEVICE USING SAID LAYERED PRODUCT, AND LAYERED PRODUCT WITH DEVICE Toyobo Co., Ltd. (JP) 2015-04-29 EP disclosed
US-8980409-B2 Laminate, method for producing same, and method for producing device structure using same TOYOBO CO., LTD. (JP) 2015-03-17 US disclosed
CN-104395080-A Method for producing laminate, method for producing laminate with device using laminate, and laminate with device TOYO BOSEKI 2015-03-04 CN disclosed
CN-103619591-A Laminate, production method thereof, and method of production of device structure by using the laminate TOYO BOSEKI 2014-03-05 CN disclosed
US-20140041800-A1 LAMINATE, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING DEVICE STRUCTURE USING SAME TOYOBO CO., LTD. (JP) 2014-02-13 US disclosed
US-20140042662-A1 LAMINATE, PRODUCTION METHOD FOR SAME, AND METHOD OF CREATING DEVICE STRUCTURE USING LAMINATE TOYOBO CO., LTD. (JP) 2014-02-13 US disclosed
CN-103502005-A Laminate, method for producing same, and method for producing device structure using same TOYO BOSEKI 2014-01-08 CN disclosed
US-8231969-B2 Asymmetrically functionalized nanoparticles UNIVERSITY OF UTAH RESEARCH FOUNDATION (US) 2012-07-31 US disclosed
US-20090256116-A1 Asymmetrically Functionalized NanoParticles UNIVERSITY OF UTAH 2009-10-15 US disclosed