Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.49 |
| ▸ | TP53 | P04637 | 3/20 | 0.49 |
| ▸ | TSHR | P16473 | 3/20 | 0.49 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.49 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.49 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.49 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.47 |
| ▸ | GLA | P06280 | 1/20 | 0.43 |
| ▸ | MEN1 | O00255 | 2/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.41 |
| ▸ | FGFR1 | P11362 | 1/20 | 0.40 |
| ▸ | SRC | P12931 | 1/20 | 0.40 |
| ▸ | MAPT | P10636 | 2/20 | 0.39 |
| ▸ | HPGD | P15428 | 2/20 | 0.39 |
| ▸ | PKM | P14618 | 2/20 | 0.39 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.39 |
| ▸ | PPARG | P37231 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | GAA | P10253 | 1/20 | 0.39 |
| ▸ | SLC6A4 | P31645 | 3/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30401946 | 1.00 | ALDH1A1 (0.49) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL29354152 | 0.94 | ALDH1A1 (0.51) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL1237561 | 0.94 | ALDH1A1 (0.51) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL17297278 | 0.94 | ALDH1A1 (0.51) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL6128495 | 0.94 | ALDH1A1 (0.51) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL29535182 | 0.94 | ALDH1A1 (0.51) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL18237415 | 0.91 | ALDH1A1 (0.51) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL30620981 | 0.91 | ALDH1A1 (0.51) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL8118094 | 0.91 | ALDH1A1 (0.51) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL12757543 | 0.91 | ALDH1A1 (0.48) | ALDH1A1TP53TSHRHIF1ACYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5302672-A | Heat resistance | DAINIPPON INK AND CHEMICALS, INC. (JP) | 1994-04-12 | — | — | US | claimed |
| US-20230141042-A1 | FLUX RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT, MOUNTING STRUCTURE, AND METHOD FOR MANUFACTURING THE MOUNTING STRUCTURE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2023-05-11 | — | — | US | disclosed |
| US-20230141042-A1 | FLUX RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT, MOUNTING STRUCTURE, AND METHOD FOR MANUFACTURING THE MOUNTING STRUCTURE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2023-05-11 | — | — | US | disclosed |
| CN-114839838-A | Photosensitive resin composition | 味之素株式会社 | 2022-08-02 | — | — | CN | disclosed |
| US-20220195177-A1 | FLUX RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT, MOUNTING STRUCTURE, AND METHOD FOR MANUFACTURING THE MOUNTING STRUCTURE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2022-06-23 | — | — | US | disclosed |
| CN-114114836-A | Photosensitive resin composition | 味之素株式会社 | 2022-03-01 | — | — | CN | disclosed |
| US-20220033640-A1 | EPOXY RESIN COMPOSITIONS, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIALS | TORAY INDUSTRIES, INC. (JP) | 2022-02-03 | — | — | US | disclosed |
| CN-113946101-A | Photosensitive resin composition | 味之素株式会社 | 2022-01-18 | — | — | CN | disclosed |
| WO-2021117758-A1 | THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE | 住友ベークライト株式会社 | 2021-06-17 | — | — | WO | disclosed |
| EP-3165549-B1 | EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THEREOF AND ELECTRONIC MEMBER | DAINIPPON INK & CHEMICALS (JP) | 2021-06-16 | — | — | EP | disclosed |
| US-20070179259-A1 | Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith | SHIN-ETSU CHEMICAL CO., LTD. | 2007-08-02 | — | — | US | disclosed |
| US-20070179259-A1 | Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith | SHIN-ETSU CHEMICAL CO., LTD. | 2007-08-02 | — | — | US | disclosed |
| US-20060258824-A1 | Flame-retardant epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards | GOO CHEMICAL CO., LTD. (JP) | 2006-11-16 | — | — | US | disclosed |
| WO-2006106892-A1 | FLAME-RETARDANT COMPOSITION FOR SOLDER RESIST AND CURED PRODUCT THEREOF | SHOWA DENKO K.K. (JP) | 2006-10-12 | — | — | WO | disclosed |
| WO-2006088230-A1 | THERMOSETTING COMPOSITION FOR SOLDER RESIST AND CURED PRODUCT THEREOF | SHOWA DENKO K.K. (JP) | 2006-08-24 | — | — | WO | disclosed |
| EP-1614713-A1 | FLAME-RETARDED EPOXY RESIN COMPOSITION, PREPREGS CONTAINING THE SAME, LAMINATED SHEETS AND PRINTED WIRING BOARDS | Goo Chemical Co., Ltd. (JP) | 2006-01-11 | — | — | EP | disclosed |
| EP-0810249-B1 | Thermosetting resin composition, electrically insulated coil, electric rotating machine and method for producing same | HITACHI LTD (JP) | 2001-11-07 | — | — | EP | disclosed |
| US-5982056-A | STATOR OF ROTATING MACHINE | HITACHI, LTD. (JP) | 1999-11-09 | — | — | US | disclosed |
| EP-0810249-A2 | Thermosetting resin composition, electrically insulated coil, electric rotating machine and method for producing same | HITACHI, LTD. (JP) | 1997-12-03 | — | — | EP | disclosed |
| US-5302672-A | Heat resistance | DAINIPPON INK AND CHEMICALS, INC. (JP) | 1994-04-12 | — | — | US | disclosed |