⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4305268 | 1.00 | — | — | |
| SCHEMBL16667775 | 0.77 | — | — | |
| SCHEMBL16667774 | 0.77 | — | — | |
| SCHEMBL16859694 | 0.75 | — | — | |
| SCHEMBL28724224 | 0.75 | — | — | |
| SCHEMBL23440241 | 0.74 | — | — | |
| SCHEMBL23440242 | 0.74 | — | — | |
| SCHEMBL6059669 | 0.73 | — | — | |
| SCHEMBL16266712 | 0.73 | — | — | |
| SCHEMBL1531353 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10662315-B2 | Epoxy resin molding material for sealing and electronic component device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-05-26 | — | — | US | disclosed |
| US-20170121505-A1 | EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE | RESONAC CORPORATION (JP) | 2017-05-04 | — | — | US | disclosed |
| CN-103221452-B | Encapsulating epoxy resin moulding material and there is the electronic part apparatus of the element sealed with this moulding material | 日立化成株式会社 | 2016-06-22 | — | — | CN | disclosed |
| US-20140128505-A1 | EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-05-08 | — | — | US | disclosed |
| CN-103221452-A | Epoxy resin based molding material for sealing and electronic part or device provided with element sealed with this molding material | HITACHI CHEMICAL CO LTD | 2013-07-24 | — | — | CN | disclosed |
| US-8084130-B2 | Epoxy resin molding material for sealing and electronic component device | HITACHI CHEMICAL CO., LTD. (JP) | 2011-12-27 | — | — | US | disclosed |
| US-20090326100-A1 | EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-12-31 | — | — | US | disclosed |
| US-20090012233-A1 | Epoxy Resin Molding Material for Sealing and Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2009-01-08 | — | — | US | disclosed |