SCHEMBL16859694

SCHEMBL16859694

CCO[Si](OCC)(OCC)C([SiH3])CCN=C(C)CC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16667775 0.84 — —
SCHEMBL16667774 0.84 — —
SCHEMBL23440242 0.80 — —
SCHEMBL23440241 0.80 — —
SCHEMBL28329919 0.77 OPRM1 (0.30) —
SCHEMBL27193190 0.76 — —
SCHEMBL4305268 0.75 — —
SCHEMBL4305275 0.75 — —
SCHEMBL16266713 0.73 — —
SCHEMBL16266712 0.73 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10029438-B2 Thermosetting resin composition and use thereof SHENGYI TECHNOLOGY CO., LTD. (CN) 2018-07-24 — — US disclosed
US-20150189747-A1 THERMOSETTING RESIN COMPOSITION AND USE THEREOF SHENGYI TECHNOLOGY CO., LTD. (CN) 2015-07-02 — — US disclosed
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