SCHEMBL431790

SCHEMBL431790

CCCO[Si](CCC[Si](OCCC)(OCCC)OCCC)(OCCC)OCCC

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL702188 0.94 LMNA (0.31) LMNA
SCHEMBL8512727 0.92 LMNA (0.34) LMNA
SCHEMBL29512548 0.92 LMNA (0.34) LMNA
SCHEMBL109400 0.92 LMNA (0.34) LMNA
SCHEMBL13268839 0.92 LMNA (0.34) LMNA
SCHEMBL30892613 0.90
Ammonia Solution, Strong SCHEMBL28115798 0.89 LMNA (0.33) LMNA
Water SCHEMBL27827345 0.89 LMNA (0.33) LMNA
Fluoride SCHEMBL28172314 0.89 LMNA (0.33) LMNA
SCHEMBL2396676 0.89 LMNA (0.38) LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9096778-B2 Cyanoacrylate adhesive with improved water resistance Henkel IP & Holding GmbH (DE) 2015-08-04 US claimed
EP-2511355-B1 Cyanoacrylate adhesive with improved water resistance HENKEL IRELAND LTD (DE) 2013-10-23 EP claimed
US-20130174981-A1 CYANOACRYLATE ADHESIVE WITH IMPROVED WATER RESISTANCE HENKEL IRELAND LIMITED (DE) 2013-07-11 US claimed
EP-2511355-A1 Cyanoacrylate adhesive with improved water resistance Henkel Ireland Ltd. (IE) 2012-10-17 EP claimed
WO-2024150783-A1 ADHESIVE COMPOSITION, ADHESIVE LAYER, OPTICAL FILM WITH ADHESIVE LAYER, AND DISPLAY DEVICE 住友化学株式会社 2024-07-18 WO disclosed
US-9096778-B2 Cyanoacrylate adhesive with improved water resistance Henkel IP & Holding GmbH (DE) 2015-08-04 US disclosed
EP-1970421-B1 COATING LIQUID FOR FORMING LOW DIELECTRIC CONSTANT AMORPHOUS SILICA COATING FILM AND LOW DIELECTRIC CONSTANT AMORPHOUS SILICA COATING FILM OBTAINED FROM SUCH COATING LIQUID JGC CATALYSTS & CHEMICALS LTD (JP) 2015-04-29 EP disclosed
EP-2511355-B1 Cyanoacrylate adhesive with improved water resistance HENKEL IRELAND LTD (DE) 2013-10-23 EP disclosed
US-20130174981-A1 CYANOACRYLATE ADHESIVE WITH IMPROVED WATER RESISTANCE HENKEL IRELAND LIMITED (DE) 2013-07-11 US disclosed
EP-2511355-A1 Cyanoacrylate adhesive with improved water resistance Henkel Ireland Ltd. (IE) 2012-10-17 EP disclosed
US-20120231575-A1 METHOD FOR PRODUCING SOLAR CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-09-13 US disclosed
EP-2495770-A1 METHOD FOR PRODUCING SOLAR CELL Hitachi Chemical Company, Ltd. (JP) 2012-09-05 EP disclosed
EP-1890172-A1 METHOD FOR FORMING ANTIREFLECTION FILM Hitachi Chemical Co., Ltd. (JP) 2008-02-20 EP disclosed
US-7297464-B2 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2007-11-20 US disclosed
EP-1829945-A1 FILM, SILICA FILM AND METHOD OF FORMING THE SAME, COMPOSITION FOR FORMING SILICA FILM, AND ELECTRONIC PART Hitachi Chemical Co., Ltd. (JP) 2007-09-05 EP disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed
EP-1672427-A1 RADIATION-CURING COMPOSITION, METHOD FOR STORING SAME, METHOD FOR FORMING CURED FILM, METHOD FOR FORMING PATTERN, METHOD FOR USING PATTERN, ELECTRONIC COMPONENT, AND OPTICAL WAVEGUIDE Hitachi Chemical Co., Ltd. (JP) 2006-06-21 EP disclosed
EP-1672426-A1 RADIATION CURABLE COMPOSITION, STORING METHOD THEREOF, FORMING METHOD OF CURED FILM, PATTERNING METHOD, USE OF PATTERN, ELECTRONIC COMPONENTS AND OPTICAL WAVEGUIDE HITACHI CHEMICAL COMPANY, LTD. (JP) 2006-06-21 EP disclosed
US-20050266344-A1 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2005-12-01 US disclosed
US-20050239953-A1 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2005-10-27 US disclosed