SCHEMBL432145

SCHEMBL432145

CO[Si](OC)(OC)C(F)(F)C(F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2202598 0.81
SCHEMBL9551492 0.81
SCHEMBL9551493 0.80
SCHEMBL4007122 0.79
SCHEMBL14351313 0.77 LMNA (0.33)
SCHEMBL8576112 0.77 LMNA (0.33)
SCHEMBL1462444 0.77 LMNA (0.33)
SCHEMBL9551512 0.77 LMNA (0.33)
SCHEMBL11520118 0.77 LMNA (0.33)
SCHEMBL2234329 0.77 LMNA (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115010932-B Hydrophobic oleophobic fluorine-containing microsphere and preparation method thereof 上海睿思畅科技发展有限公司 2023-11-03 CN claimed
CN-110085596-B Three-dimensional memory, preparation method thereof and electronic equipment 长江存储科技有限责任公司 2022-03-25 CN claimed
CN-119660874-A Composite material, device and method for efficiently extracting uranium from salt lake water flow 中国工程物理研究院材料研究所 2025-03-21 CN disclosed
CN-118725731-A Coating composition, coating, preparation method and application 宁波天璇新材料科技有限公司 2024-10-01 CN disclosed
US-11881400-B2 Silicon-containing layer-forming composition, and method for producing pattern-equipped substrate which uses same CENTRAL GLASS COMPANY, LIMITED (JP) 2024-01-23 US disclosed
US-20230408922-A1 APPLICATION LIQUID FOR OPTICAL MEMBER, POLYMER, PHOTOSENSITIVE APPLICATION LIQUID, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING PATTERNED CURED FILM, AND METHOD FOR PRODUCING POLYMER CENTRAL GLASS COMPANY, LIMITED (JP) 2023-12-21 US disclosed
US-20230333468-A1 RESIN COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM, SUBSTRATE HAVING MULTILAYER FILM, METHOD FOR PRODUCING PATTERNED SUBSTRATE, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN CURED FILM, METHOD FOR PRODUCING POLYMER, AND METHOD FOR PRODUCING RESIN COMPOSITION CENTRAL GLASS COMPANY, LIMITED (JP) 2023-10-19 US disclosed
CN-113045970-B Coating composition and coated article 株式会社尼欧斯 2023-10-13 CN disclosed
US-20230322818-A1 SILICON COMPOUND, REACTIVE MATERIAL, RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD OF MANUFACTURING CURED FILM, PATTERNED CURED FILM, AND METHOD OF MANUFACTURING PATTERNED CURED FILM CENTRAL GLASS COMPANY, LIMITED (JP) 2023-10-12 US disclosed
US-20230244145-A1 SILICON-CONTAINING MONOMER MIXTURE, POLYSILOXANE, RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PRODUCTION METHOD FOR CURED FILM, PATTERNED CURED FILM, AND PRODUCTION METHOD FOR PATTERNED CURED FILM CENTRAL GLASS COMPANY, LIMITED (JP) 2023-08-03 US disclosed
US-20230037301-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN STRUCTURE AND METHOD FOR PRODUCING PATTERNED CURED FILM CENTRAL GLASS COMPANY, LIMITED (JP) 2023-02-09 US disclosed
US-20050266344-A1 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2005-12-01 US disclosed
US-20050255326-A1 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts HITACHI CHEMICAL CO., LTD. (JP) 2005-11-17 US disclosed
US-20050239953-A1 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2005-10-27 US disclosed
US-20050119394-A1 Comprising polysiloxane obtained by hydrolytic condensation; alcoholic solvent alcohol capable of dissolving siloxane resin, ammonium salt, and thermal decomposing/volatile compound; curing; bonding and high strength; mechanical properties HITACHI CHEMICAL CO., LTD. (JP) 2005-06-02 US disclosed
US-20050101581-A1 Therapeutic treatment methods 2 BIOVIE INC. 2005-05-12 US disclosed
US-20050014438-A1 Electron emitting device, electron source, image forming apparatus and producing methods of them CANON KABUSHIKI KAISHA (JP) 2005-01-20 US disclosed
US-6827619-B2 Electron emitting device, electron source, image forming apparatus and producing methods of them CANON KABUSHIKI KAISHA (JP) 2004-12-07 US disclosed
US-20030020395-A1 Electron emitting device, electron source, image forming apparatus and producing methods of them ODA HITOSHI (JP) 2003-01-30 US disclosed
US-6492769-B1 Electron emitting device, electron source, image forming apparatus and producing methods of them CANON KABUSHIKI KAISHA (JP) 2002-12-10 US disclosed