Miristalkonium Ion

Miristalkonium Ion

SCHEMBL4328255

CC(=O)[O-].CCCCCCCCCCCCCC[N+](C)(C)Cc1ccccc1

nearest known ligand 0.79

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ADRA2AADRA2BADRA2CADRB2AGTR1AVPR1AAVPR1BAVPR2BDKRB2CALCRCHRNA3CHRNB4ESR1ESR2GHSRGNRHRGSC1HSPA8MALT1MC1RMC4RNOS1NOS2NOS3OPRK1OXTRRAMP1RAMP2RAMP3SCN5ASSTR1SSTR2SSTR3SSTR4SSTR5dacAdacBdacCfolPftsImrcAmrcBmrdArplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of Miristalkonium Ion. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MC4R known ✓ P32245 1/20 0.55
ESR1 known ✓ P03372 1/20 0.47
ADRB2 known ✓ P07550 1/20 0.47
ADRA2A known ✓ P08913 1/20 0.47
ADRA2B known ✓ P18089 1/20 0.47
ADRA2C known ✓ P18825 1/20 0.47
AVPR2 known ✓ P30518 1/20 0.47
AGTR1 known ✓ P30556 1/20 0.47
AVPR1A known ✓ P37288 1/20 0.47
OPRK1 known ✓ P41145 1/20 0.47
GHSR known ✓ Q92847 1/20 0.47
DNM1 Q05193 2/20 0.79
MEN1 O00255 3/20 0.77
KMT2A Q03164 3/20 0.77
MAPK1 P28482 2/20 0.77
SMN1; SMN2 Q16637 2/20 0.77
TP53 P04637 1/20 0.77
HTT P42858 3/20 0.74
PSMD14 O00487 1/20 0.55
HSP90AA1 P07900 1/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acetic Acid SCHEMBL11743334 1.00 DNM1 (0.79) DNM1MEN1KMT2AMAPK1SMN1; SMN2
Cetalkonium SCHEMBL8162832 1.00 DNM1 (0.79) DNM1MEN1KMT2AMAPK1SMN1; SMN2
Benzododecinium SCHEMBL4455906 1.00 DNM1 (0.79) DNM1MEN1KMT2AMAPK1SMN1; SMN2
Acetic Acid SCHEMBL11748087 1.00 DNM1 (0.79) DNM1MEN1KMT2AMAPK1SMN1; SMN2
Cetalkonium SCHEMBL8163175 0.98 MEN1 (0.79) DNM1MEN1KMT2AMAPK1SMN1; SMN2
Cetalkonium SCHEMBL27585255 0.97 DNM1 (0.74) DNM1MEN1KMT2AMAPK1SMN1; SMN2
Benzododecinium SCHEMBL28637938 0.95 DNM1 (0.81) DNM1MEN1KMT2AMAPK1SMN1; SMN2
Cetalkonium SCHEMBL8168586 0.95 DNM1 (0.81) DNM1MEN1KMT2AMAPK1SMN1; SMN2
Benzododecinium SCHEMBL8164470 0.95 DNM1 (0.81) DNM1MEN1KMT2AMAPK1SMN1; SMN2
Benzododecinium SCHEMBL17435029 0.94 DNM1 (0.70) DNM1MEN1KMT2AMAPK1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111154552-A Diamond surface cleaning solution and application thereof 中国科学院宁波材料技术与工程研究所 2020-05-15 CN claimed
CN-102102008-B Water-based glass grinding fluid and using method thereof ANJI MICROELECTRONICS SHANGHAI 2014-07-23 CN claimed
CN-102102008-A Water-based glass grinding fluid and using method thereof ANJI MICROELECTRONICS SHANGHAI 2011-06-22 CN claimed
CN-118063928-A Composite resin composition, method for producing same, insulating resin composite, and electric power device using same 株式会社日立制作所 2024-05-24 CN disclosed
CN-111154552-A Diamond surface cleaning solution and application thereof 中国科学院宁波材料技术与工程研究所 2020-05-15 CN disclosed
CN-102102008-B Water-based glass grinding fluid and using method thereof ANJI MICROELECTRONICS SHANGHAI 2014-07-23 CN disclosed
CN-102102008-A Water-based glass grinding fluid and using method thereof ANJI MICROELECTRONICS SHANGHAI 2011-06-22 CN disclosed
WO-2009141208-A1 EPOXY RESIN COMPOSITION AND ELECTRONIC PART EVONIK DEGUSSA GMBH (DE) 2009-11-26 WO disclosed
EP-2123712-A1 Epoxy resin composition and electronic part Evonik Degussa GmbH (DE) 2009-11-25 EP disclosed
EP-1273608-B1 FLAME-RETARDANT EPOXY RESIN COMPOSITION, MOLDED OBJECT THEREOF, AND ELECTRONIC PART OTSUKA KAGAKU KK (JP) 2007-07-04 EP disclosed
US-6905768-B2 Crosslinked, encapsulated mixture for electronics; heat resistance, waterproofing, impact strength OTSUKA CHEMICAL CO., LTD. (JP) 2005-06-14 US disclosed
US-4522981-A ACRYLATE COPOLYMER HAVING BOTH HYDROXY GROUPS REACTED WITH PARTIALLY BLOCKED POLYIUSOCYANATE AND GLYCIDYL GROUPS; HEATING TO LIBERATE ISOCYANATE AND REACT WITH GLYCIDYL GROUPS BASF FARBEN & FASERN AG (DE) 1985-06-11 US disclosed
EP-0071812-B1 POWDER LACQUERS BASF Lacke + Farben AG (DE) 1985-02-20 EP disclosed
EP-0012566-B1 ELECTRIC WINDINGS AND PRODUCTION THEREOF Hitachi, Ltd. (JP) 1983-06-22 EP disclosed
EP-0071813-A2 Synthetic resin BASF Lacke + Farben AG (DE) 1983-02-16 EP disclosed
EP-0071812-A2 Powder lacquers BASF Lacke + Farben AG (DE) 1983-02-16 EP disclosed
US-4269894-A AS BINDERS FOR THE MULTILAYERED INSULATION; IMPREGNATING WITH A VARNISH OF EPOXY-ISOCYANATE RESIN; WATERPROOFING HITACHI, LTD. (JP) 1981-05-26 US disclosed
US-4222802-A SILICONE RESIN INSULATOR, IMPREGNATING WITH VARNISH OF AN EPOXY COMPOUND AND AN ISOCYANATE COMPOUND, CURING HITACHI, LTD. (JP) 1980-09-16 US disclosed
EP-0012566-A1 Electric windings and production thereof Hitachi, Ltd. (JP) 1980-06-25 EP disclosed
US-4100118-A POLYGLYCIDYL ESTER OF A FATTY ACID, ISOCYANATE COMPOUND AND CURING CATALYST, THERMAL RESISTANCE, THERMAL SHOCK RESISTANCE HITACHI, LTD. (JP) 1978-07-11 US disclosed