Known targets — ChEMBL curated mechanism
ADRA2AADRA2BADRA2CADRB2AGTR1AVPR1AAVPR1BAVPR2BDKRB2CALCRCHRNA3CHRNB4ESR1ESR2GHSRGNRHRGSC1HSPA8MALT1MC1RMC4RNOS1NOS2NOS3OPRK1OXTRRAMP1RAMP2RAMP3SCN5ASSTR1SSTR2SSTR3SSTR4SSTR5dacAdacBdacCfolPftsImrcAmrcBmrdArplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO
The experimentally established mechanism targets of Acetic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CSNK1E | P49674 | 1/20 | 0.52 |
| ▸ | MMP2 | P08253 | 17/20 | 0.46 |
| ▸ | MMP3 | P08254 | 12/20 | 0.46 |
| ▸ | MMP1 | P03956 | 10/20 | 0.46 |
| ▸ | CNR2 | P34972 | 1/20 | 0.45 |
| ▸ | MMP7 | P09237 | 6/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Bicarbonate SCHEMBL9739767 | 0.96 | CSNK1E (0.54) | CSNK1EMMP2MMP3MMP1CNR2 | |
| SCHEMBL8386222 | 0.93 | CSNK1E (0.55) | CSNK1EMMP2MMP3MMP1MMP7 | |
| SCHEMBL8387575 | 0.93 | CSNK1E (0.55) | CSNK1EMMP2MMP3MMP1MMP7 | |
| SCHEMBL2392222 | 0.93 | CSNK1E (0.55) | CSNK1EMMP2MMP3MMP1MMP7 | |
| SCHEMBL25283495 | 0.93 | CSNK1E (0.55) | CSNK1EMMP2MMP3MMP1MMP7 | |
| SCHEMBL25287896 | 0.93 | CSNK1E (0.55) | CSNK1EMMP2MMP3MMP1MMP7 | |
| SCHEMBL8381675 | 0.93 | CSNK1E (0.55) | CSNK1EMMP2MMP3MMP1MMP7 | |
| SCHEMBL8382904 | 0.93 | CSNK1E (0.55) | CSNK1EMMP2MMP3MMP1MMP7 | |
| SCHEMBL8382112 | 0.93 | CSNK1E (0.55) | CSNK1EMMP2MMP3MMP1MMP7 | |
| SCHEMBL8386102 | 0.93 | CSNK1E (0.55) | CSNK1EMMP2MMP3MMP1MMP7 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118063928-A | Composite resin composition, method for producing same, insulating resin composite, and electric power device using same | 株式会社日立制作所 | 2024-05-24 | — | — | CN | disclosed |
| WO-2009141208-A1 | EPOXY RESIN COMPOSITION AND ELECTRONIC PART | EVONIK DEGUSSA GMBH (DE) | 2009-11-26 | — | — | WO | disclosed |
| EP-2123712-A1 | Epoxy resin composition and electronic part | Evonik Degussa GmbH (DE) | 2009-11-25 | — | — | EP | disclosed |
| US-6905768-B2 | Crosslinked, encapsulated mixture for electronics; heat resistance, waterproofing, impact strength | OTSUKA CHEMICAL CO., LTD. (JP) | 2005-06-14 | — | — | US | disclosed |
| EP-1270668-B1 | EPOXY RESIN COMPOSITION AND ELECTRONIC PART | OTSUKA CHEMICAL CO LTD (JP) | 2004-04-21 | — | — | EP | disclosed |
| US-20030153650-A1 | Epoxy resin, a phenolic hydroxyl group-containng compound, a urea resin and a melamine resin, a crosslinked phenoxy phosphazene compound, and an inorganic filler | OTSUKA CHEMICAL CO., LTD. (JP) | 2003-08-14 | — | — | US | disclosed |
| EP-1270668-A1 | EPOXY RESIN COMPOSITION AND ELECTRONIC PART | Otsuka Chemical Co., Ltd. (JP) | 2003-01-02 | — | — | EP | disclosed |
| EP-0635528-B1 | Epoxy-modified polyamide resin | HITACHI CHEMICAL CO LTD (JP) | 2002-09-18 | — | — | EP | disclosed |
| US-6060215-A | FOR PRODUCING A FLEXIBLE PRINTED CIRCUIT BOARD | HITACHI, LTD. (JP) | 2000-05-09 | — | — | US | disclosed |
| US-5874518-A | Epoxy-modified polyamide resin | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1999-02-23 | — | — | US | disclosed |
| EP-0635528-A2 | Epoxy-modified polyamide resin | Hitachi Chemical Co., Ltd. (JP) | 1995-01-25 | — | — | EP | disclosed |
| EP-0503744-A2 | Curable resin compositions and semiconductor devices coated and sealed with the same | HITACHI, LTD. (JP) | 1992-09-16 | — | — | EP | disclosed |
| EP-0237255-A2 | Curable resin compositions and semiconductor devices coated and sealed with the same | HITACHI, LTD. (JP) | 1987-09-16 | — | — | EP | disclosed |
| US-4539218-A | Synthetic resin | BASF FARBEN & FASERN AG (DE) | 1985-09-03 | — | — | US | disclosed |
| US-4522981-A | ACRYLATE COPOLYMER HAVING BOTH HYDROXY GROUPS REACTED WITH PARTIALLY BLOCKED POLYIUSOCYANATE AND GLYCIDYL GROUPS; HEATING TO LIBERATE ISOCYANATE AND REACT WITH GLYCIDYL GROUPS | BASF FARBEN & FASERN AG (DE) | 1985-06-11 | — | — | US | disclosed |
| EP-0012566-B1 | ELECTRIC WINDINGS AND PRODUCTION THEREOF | Hitachi, Ltd. (JP) | 1983-06-22 | — | — | EP | disclosed |
| US-4269894-A | AS BINDERS FOR THE MULTILAYERED INSULATION; IMPREGNATING WITH A VARNISH OF EPOXY-ISOCYANATE RESIN; WATERPROOFING | HITACHI, LTD. (JP) | 1981-05-26 | — | — | US | disclosed |
| US-4222802-A | SILICONE RESIN INSULATOR, IMPREGNATING WITH VARNISH OF AN EPOXY COMPOUND AND AN ISOCYANATE COMPOUND, CURING | HITACHI, LTD. (JP) | 1980-09-16 | — | — | US | disclosed |
| US-4100118-A | POLYGLYCIDYL ESTER OF A FATTY ACID, ISOCYANATE COMPOUND AND CURING CATALYST, THERMAL RESISTANCE, THERMAL SHOCK RESISTANCE | HITACHI, LTD. (JP) | 1978-07-11 | — | — | US | disclosed |