SCHEMBL4330059

SCHEMBL4330059

NN(CCCO)CCCO

nearest known ligand 0.32

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.32
TSHR P16473 1/20 0.32
MAPT P10636 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19705393 0.94
SCHEMBL6865189 0.90 SMN1; SMN2 (0.35) ALDH1A1TSHRSMN1; SMN2
SCHEMBL14159018 0.87 LMNA (0.38) ALDH1A1TSHRSMN1; SMN2
SCHEMBL9193298 0.86
SCHEMBL27715014 0.82
SCHEMBL3628938 0.78 CYP2C19 (0.46) ALDH1A1TSHRMAPTSMN1; SMN2
SCHEMBL122628 0.77
SCHEMBL25775735 0.76 MAPT (0.30) MAPT
SCHEMBL13154479 0.76
Hydrochloric Acid SCHEMBL5391210 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8084184-B2 Composition for removing photoresist and method of manufacturing an array substrate using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-12-27 US claimed
US-20090170037-A1 COMPOSITION FOR REMOVING PHOTORESIST AND METHOD OF MANUFACTURING AN ARRAY SUBSTRATE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-07-02 US claimed
EP-1154868-A4 NON-CORROSIVE CLEANING COMPOSITION AND METHOD FOR REMOVING PLASMA ETCHING RESIDUES ARCH SPEC CHEM INC (US) 2004-03-24 EP claimed
EP-1154868-A1 NON-CORROSIVE CLEANING COMPOSITION AND METHOD FOR REMOVING PLASMA ETCHING RESIDUES ARCH SPECIALTY CHEMICALS, INC. (US) 2001-11-21 EP claimed
US-6103680-A COMPRISING A HYDROXY-(LOWER ALKYL)-HYDRAZINE, WATER, AND AT LEAST ONE CARBOXYLIC ACID SELECTED FROM CITRIC ACID, LACTIC ACID, SUCCINIC ACID, TARTARIC ACID, ETHYLENEDIAMINETETRAACETIC ACID, NITRILOTRIACETIC ACID ARCH SPECIALTY CHEMICALS, INC. (US) 2000-08-15 US claimed
WO-2000040347-A1 NON-CORROSIVE CLEANING COMPOSITION AND METHOD FOR REMOVING PLASMA ETCHING RESIDUES ARCH SPECIALTY CHEMICALS, INC. (US) 2000-07-13 WO claimed
WO-1996004223-A1 REDUCED VOLATILITY SUBSTITUTED HYDRAZINE COMPOUNDS IN LIQUID PROPELLANTS OLIN CORPORATION (US) 1996-02-15 WO claimed
US-5433802-A Hydroxy or cyano substituted hydrazines, nitrogen oxide oxidizers OLIN CORPORATION (US) 1995-07-18 US claimed
US-8084184-B2 Composition for removing photoresist and method of manufacturing an array substrate using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-12-27 US disclosed
US-20090170037-A1 COMPOSITION FOR REMOVING PHOTORESIST AND METHOD OF MANUFACTURING AN ARRAY SUBSTRATE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-07-02 US disclosed
EP-1154868-A4 NON-CORROSIVE CLEANING COMPOSITION AND METHOD FOR REMOVING PLASMA ETCHING RESIDUES ARCH SPEC CHEM INC (US) 2004-03-24 EP disclosed
EP-1154868-A1 NON-CORROSIVE CLEANING COMPOSITION AND METHOD FOR REMOVING PLASMA ETCHING RESIDUES ARCH SPECIALTY CHEMICALS, INC. (US) 2001-11-21 EP disclosed
US-6103680-A COMPRISING A HYDROXY-(LOWER ALKYL)-HYDRAZINE, WATER, AND AT LEAST ONE CARBOXYLIC ACID SELECTED FROM CITRIC ACID, LACTIC ACID, SUCCINIC ACID, TARTARIC ACID, ETHYLENEDIAMINETETRAACETIC ACID, NITRILOTRIACETIC ACID ARCH SPECIALTY CHEMICALS, INC. (US) 2000-08-15 US disclosed
WO-2000040347-A1 NON-CORROSIVE CLEANING COMPOSITION AND METHOD FOR REMOVING PLASMA ETCHING RESIDUES ARCH SPECIALTY CHEMICALS, INC. (US) 2000-07-13 WO disclosed
WO-1996004223-A1 REDUCED VOLATILITY SUBSTITUTED HYDRAZINE COMPOUNDS IN LIQUID PROPELLANTS OLIN CORPORATION (US) 1996-02-15 WO disclosed
US-5433802-A Hydroxy or cyano substituted hydrazines, nitrogen oxide oxidizers OLIN CORPORATION (US) 1995-07-18 US disclosed