SCHEMBL4334824

SCHEMBL4334824

CCCCCCCCCOP(Oc1ccccc1)Oc1ccccc1

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 2/20 0.51
MLNR O43193 1/20 0.45
NR1I2 O75469 1/20 0.45
ESR1 P03372 1/20 0.45
NR3C1 P04150 1/20 0.45
PGR P06401 1/20 0.45
ADRB2 P07550 1/20 0.45
CHRM2 P08172 1/20 0.45
ADRB1 P08588 1/20 0.45
HTR1A P08908 1/20 0.45
ADRA2A P08913 1/20 0.45
ADORA3 P0DMS8 1/20 0.45
CHRM1 P11229 1/20 0.45
DRD2 P14416 1/20 0.45
ADRA2B P18089 1/20 0.45
ADRA2C P18825 1/20 0.45
CHRM3 P20309 1/20 0.45
MAOA P21397 1/20 0.45
CNR1 P21554 1/20 0.45
SLC6A2 P23975 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL98055 1.00 LTA4H (0.51) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL301390 1.00 LTA4H (0.51) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL1929304 1.00 LTA4H (0.51) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL465447 1.00 LTA4H (0.51) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL1725080 1.00 LTA4H (0.51) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL3298592 1.00 LTA4H (0.51) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL1725897 1.00 LTA4H (0.51) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL272838 1.00 LTA4H (0.51) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL1925836 1.00 LTA4H (0.51) LTA4HMLNRNR1I2ESR1NR3C1
SCHEMBL1927650 1.00 LTA4H (0.51) LTA4HMLNRNR1I2ESR1NR3C1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12398266-B2 Polycarbonate resin composition IDEMITSU KOSAN CO., LTD. (JP) 2025-08-26 US disclosed
US-20250205637-A1 GAS SEPARATION MEMBRANE IDEMITSU KOSAN CO., LTD. (JP) 2025-06-26 US disclosed
EP-4556507-A1 POLYCARBONATE-POLYORGANOSILOXANE COPOLYMER, POLYCARBONATE RESIN COMPOSITION AND MOLDED BODY Idemitsu Kosan Co.,Ltd. (JP) 2025-05-21 EP disclosed
US-20250145819-A1 POLYCARBONATE-BASED RESIN COMPOSITION IDEMITSU KOSAN CO.,LTD. (JP) 2025-05-08 US disclosed
CN-119522247-A Polycarbonate-polyorganosiloxane copolymer, polycarbonate resin composition, and molded article 出光兴产株式会社 2025-02-25 CN disclosed
US-20240368403-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE IDEMITSU KOSAN CO.,LTD. (JP) 2024-11-07 US disclosed
EP-4458832-A1 METHOD OF TRANSESTERIFICATION OF PHOSPHITES PCC ROKITA Spolka Akcyjna (PL) 2024-11-06 EP disclosed
US-20240294706-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE IDEMITSU KOSAN CO., LTD. (JP) 2024-09-05 US disclosed
US-20240294763-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE IDEMITSU KOSAN CO., LTD. (JP) 2024-09-05 US disclosed
US-20240287258-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE IDEMITSU KOSAN CO., LTD. (JP) 2024-08-29 US disclosed
CN-104023928-A Polycarbonate resin composition pellet and method for producing same IDEMITSU KOSAN CO 2014-09-03 CN disclosed
EP-1369457-B1 FLAME-RETARDANT POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF IDEMITSU KOSAN CO (JP) 2012-10-17 EP disclosed
US-20090091045-A1 Themosetting Composition for Optical Semiconductor, Die Bond Material for Optical Semiconductor Device, Underfill Material for Optical Semiconductor Device, Sealing Agent for Optical Semiconductor Device, and Optical Semiconductor Device SEKISUI CHEMICAL CO., LTD 2009-04-09 US disclosed
EP-2017295-A1 THERMOSETTING COMPOSITION FOR OPTICAL SEMICONDUCTOR, DIE BOND MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, UNDERFILL MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, SEALING AGENT FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE Sekisui Chemical Co., Ltd. (JP) 2009-01-21 EP disclosed
US-6995211-B2 Flame-retardant polycarbonate resin composition and molded article thereof IDEMITSU KOSAN CO., LTD. (JP) 2006-02-07 US disclosed
US-20040054045-A1 Flame-retardant polycarbonate resin composition and molded article thereof IDEMITSU KOSAN CO. LTD. (JP) 2004-03-18 US disclosed
EP-1369457-A1 FLAME-RETARDANT POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2003-12-10 EP disclosed
US-5237074-A Diels-alder reaction using maleic anhydride NEW JAPAN CHEMICAL CO., LTD. (JP) 1993-08-17 US disclosed
US-4062829-A PHOSPHORUS CONTAINING DICARBOXYLIC ACID ESTERS EMERY INDUSTRIES, INC. (US) 1977-12-13 US disclosed
US-3994844-A Vinyl halide resin compositions containing zinc organic phosphites EMERY INDUSTRIES, INC. (US) 1976-11-30 US disclosed