SCHEMBL4344017

SCHEMBL4344017

C[SiH2]O[SiH2][Si](C)(C)O[SiH2][SiH2]O[SiH](c1ccccc1)c1ccccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7715457 0.88
SCHEMBL3672783 0.87
SCHEMBL7595868 0.78
SCHEMBL5552345 0.77
SCHEMBL1000447 0.75
SCHEMBL872785 0.74
SCHEMBL7528417 0.72 CA4 (0.32)
SCHEMBL18585176 0.70
SCHEMBL722575 0.67
SCHEMBL1071878 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11884820-B2 Silicone gel composition and cured product thereof, and power module SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-01-30 US disclosed
US-20230241594-A1 CATALYST FOR HYDROSILYLATION REACTION, HYDROGENATION REACTION, AND HYDROSILANE REDUCTION REACTION KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION (JP) 2023-08-03 US disclosed
EP-3590596-B1 CATALYST FOR HYDROSILYLATION REACTION, HYDROGENATION REACTION, AND HYDROSILANE REDUCTION REACTION UNIV KYUSHU NAT UNIV CORP (JP) 2023-07-12 EP disclosed
US-11639149-B2 Flame-resistant airbag, method of manufacturing flame-resistant airbag, and addition-curable liquid silicone rubber composition for flame-resistant airbags SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-02 US disclosed
US-20210317310-A1 SILICONE GEL COMPOSITION AND CURED PRODUCT THEREOF, AND POWER MODULE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed
EP-3831887-A1 SILICONE GEL COMPOSITION AND CURED PRODUCT THEREOF, AND POWER MODULE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-06-09 EP disclosed
US-10738190-B2 Resin composition containing supported platinum catalyst, thermosetting organopolysiloxane composition using the resin composition, and method for curing the thermosetting organopolysiloxane composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-08-11 US disclosed
US-20200070764-A1 FLAME-RESISTANT AIRBAG, METHOD OF MANUFACTURING FLAME-RESISTANT AIRBAG, AND ADDITION-CURABLE LIQUID SILICONE RUBBER COMPOSITION FOR FLAME-RESISTANT AIRBAGS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-03-05 US disclosed
US-20190100649-A1 RESIN COMPOSITION CONTAINING SUPPORTED PLATINUM CATALYST, THERMOSETTING ORGANOPOLYSILOXANE COMPOSITION USING THE RESIN COMPOSITION, AND METHOD FOR CURING THE THERMOSETTING ORGANOPOLYSILOXANE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-04-04 US disclosed
EP-3425008-A1 SUPPORTED PLATINUM CATALYST-CONTAINING RESIN COMPOSITION, AND THERMOSETTING ORGANOPOLYSILOXANE COMPOSITION USING SAME AND CURING METHOD THEREFOR Shin-Etsu Chemical Co., Ltd. (JP) 2019-01-09 EP disclosed
EP-2042559-B1 Addition curable silicone rubber composition and cured product thereof SHINETSU CHEMICAL CO (JP) 2013-02-27 EP disclosed
EP-2042559-A1 Addition curable silicone rubber composition and cured product thereof Shin-Etsu Chemical Co., Ltd. (JP) 2009-04-01 EP disclosed
US-20090082527-A1 ADDITION CURABLE SILICONE RUBBER COMPOSITION AND CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-03-26 US disclosed
EP-1006145-B1 Addition-curable silicone rubber composition SHINETSU CHEMICAL CO (JP) 2003-02-26 EP disclosed
US-20020016019-A1 PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE PACKAGE AND ORGANOPOLYSILOXANE COMPOSITION USED THEREFOR IKENO MASAYUKI (JP) 2002-02-07 US disclosed
US-6274658-B1 ACRYLATED RESIN; USING PLATINUM CATALYST; STORAGE STABILITY; FAST CURING SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-08-14 US disclosed
EP-1006145-A1 Addition-curable silicone rubber composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-06-07 EP disclosed
EP-0939440-A2 Process for producing semiconductor device package and organopolysiloxane composition used therefor SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-09-01 EP disclosed