SCHEMBL4348774

SCHEMBL4348774

CCCCC(CC(CC)CCCCOOC(C)(C)C)C(=O)O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA2 P00918 9/20 0.46
MAPK1 P28482 1/20 0.46
SLC1A2 P43004 3/20 0.44
SLC1A1 P43005 3/20 0.44
SLC1A3 P43003 2/20 0.44
GRIK1 P39086 3/20 0.43
GRIK2 Q13002 3/20 0.43
CA1 P00915 3/20 0.36
TSHR P16473 2/20 0.36
CYP3A4 P08684 1/20 0.36
ATM Q13315 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
ALDH1A1 P00352 1/20 0.34
HDAC3 O15379 1/20 0.33
HDAC4 P56524 1/20 0.33
HDAC1 Q13547 1/20 0.33
HDAC7 Q8WUI4 1/20 0.33
HDAC2 Q92769 1/20 0.33
HDAC10 Q969S8 1/20 0.33
HDAC11 Q96DB2 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19371527 0.88 CA2 (0.43) CA2MAPK1SLC1A2SLC1A1SLC1A3
SCHEMBL6432621 0.87 CA2 (0.42) CA2MAPK1SLC1A2SLC1A1SLC1A3
SCHEMBL2230971 0.82 CA2 (0.62) CA2MAPK1SLC1A2SLC1A1SLC1A3
SCHEMBL867735 0.82 CA2 (0.67) CA2MAPK1SLC1A2SLC1A1SLC1A3
SCHEMBL7704718 0.81 CHRM1 (0.53) CA2MAPK1SLC1A2SLC1A1SLC1A3
SCHEMBL6508633 0.81 GRIK1 (0.62) CA2MAPK1SLC1A2SLC1A1SLC1A3
SCHEMBL9188141 0.81 GRIK1 (0.62) CA2MAPK1SLC1A2SLC1A1SLC1A3
SCHEMBL20918220 0.81 GRIK1 (0.62) CA2MAPK1SLC1A2SLC1A1SLC1A3
SCHEMBL160551 0.81 GRIK1 (0.62) CA2MAPK1SLC1A2SLC1A1SLC1A3
SCHEMBL1134730 0.81 GRIK1 (0.62) CA2MAPK1SLC1A2SLC1A1SLC1A3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024038771-A1 WATER REPELLENT COMPOSITION AND FIBER TREATMENT AGENT 信越化学工業株式会社 2024-02-22 WO disclosed
US-20090278284-A1 PROCESS FOR MAKING A DIP-FORMING COMPOSITION AND A DIP-FORMED ARTICLE KODAMA KAZUMI 2009-11-12 US disclosed
US-20080051498-A1 Dip-Forming Composition and Dip-Formed Article ZEON CORPORATION (JP) 2008-02-28 US disclosed
EP-1826236-A1 COMPOSITION FOR DIP FORMING AND DIP-FORMED MOLDING ZEON CORPORATION (JP) 2007-08-29 EP disclosed
EP-0488019-B1 Expansible styrene polymers with high expansibility BASF AG (DE) 1996-03-13 EP disclosed
US-5155190-A Suspension polymerization, excellent heat resistance, weatherproofing and transparency HITACHI CHEMICAL COMPANY (JP) 1992-10-13 US disclosed
EP-0489305-A2 Oil resistant expandable styrene polymerisates BASF Aktiengesellschaft (DE) 1992-06-10 EP disclosed
EP-0488019-A2 Expansible styrene polymers with high expansibility BASF Aktiengesellschaft (DE) 1992-06-03 EP disclosed