SCHEMBL434893

SCHEMBL434893

C/C=C\O[CH]CCCCC

nearest known ligand 0.39

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.39
FAAH O00519 3/20 0.34
TRPV1 Q8NER1 1/20 0.34
THRB P10828 1/20 0.33
ALDH1A1 P00352 1/20 0.32
DNM1 Q05193 3/20 0.32
LPAR3 Q9UBY5 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL435520 0.92
SCHEMBL435870 0.81
SCHEMBL16588385 0.79 FAAH (0.45) FAAHTRPV1
SCHEMBL5611566 0.78 FAAH (0.48) TSHRFAAHTRPV1
SCHEMBL437921 0.73
SCHEMBL5612139 0.72
SCHEMBL37875 0.70
SCHEMBL7523487 0.70 TSHR (0.36) TSHRFAAHTRPV1ALDH1A1LPAR3
SCHEMBL17530086 0.70 TSHR (0.56) TSHRFAAHTRPV1THRBALDH1A1
SCHEMBL15718196 0.70 TSHR (0.56) TSHRFAAHTRPV1THRBALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11319410-B2 Precursor for polyimide and use thereof ETERNAL MATERIALS CO., LTD. (TW) 2022-05-03 US claimed
US-10731004-B2 Polyimide precursor composition and use thereof ETERNAL MATERIALS CO., LTD. (TW) 2020-08-04 US claimed
US-10626220-B2 Precursor for polyimide and use thereof ETERNAL MATERIALS CO., LTD. (TW) 2020-04-21 US claimed
US-20180194899-A1 PRECURSOR FOR POLYIMIDE AND USE THEREOF ETERNAL MATERIALS CO., LTD. (TW) 2018-07-12 US claimed
US-20180148544-A1 PRECURSOR FOR POLYIMIDE AND USE THEREOF ETERNAL MATERIAL CO., LTD. (TW) 2018-05-31 US claimed
US-20180148541-A1 POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF ETERNAL MATERIALS CO., LTD. (TW) 2018-05-31 US claimed
US-9334369-B2 Polyimide precursor composition and preparation method and use thereof ETERNAL CHEMICAL CO., LTD. (TW) 2016-05-10 US claimed
US-8735534-B2 Precursor composition for polyimide and use thereof ETERNAL CHEMICAL CO., LTD. (TW) 2014-05-27 US claimed
US-20130172494-A1 POLYIMIDE PRECURSOR COMPOSITION AND PREPARATION METHOD AND USE THEREOF ETERNAL CHEMICAL CO., LTD. (TW) 2013-07-04 US claimed
US-8101703-B2 Precursor solution for polyimide/silica composite material, its manufacture method, and polyimide/silica composite material having low volume shrinkage ETERNAL CHEMICAL CO., LTD (TW) 2012-01-24 US claimed
US-20100297455-A1 PRECURSOR SOLUTION FOR POLYIMIDE/SILICA COMPOSITE MATERIAL, ITS MANUFACTURE METHOD, AND POLYIMIDE/SILICA COMPOSITE MATERIAL HAVING LOW VOLUME SHRINKAGE ETERNAL CHEMICAL CO., LTD. 2010-11-25 US claimed
US-7790828-B2 Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage ETERNAL CHEMICAL CO., LTD. (CN) 2010-09-07 US claimed
US-20100168265-A1 PRECURSOR COMPOSITION FOR POLYIMIDE AND USE THEREOF ETERNAL CHEMICAL CO., LTD. (TW) 2010-07-01 US claimed
US-20080096997-A1 Amic acid ester oligomer precursor composition for polyimide resin containing the same, and uses ETERNAL MATERIALS CO., LTD. (TW) 2008-04-24 US claimed
US-20050245715-A1 Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage ETERNAL CHEMICAL CO., LTD. 2005-11-03 US claimed
CN-116954023-A Negative photosensitive resin composition, cured film, and pattern cured film 武汉柔显科技股份有限公司 2023-10-27 CN disclosed
CN-110835408-B Preparation method of polyimide 长兴材料工业股份有限公司 2022-06-03 CN disclosed
US-20050245715-A1 Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage ETERNAL CHEMICAL CO., LTD. 2005-11-03 US disclosed
US-20040102601-A1 Useful as overcoating materials and interlayer insulating materials for wiring boards SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2004-05-27 US disclosed
EP-1375553-A1 CURABLE RESIN, CURABLE RESIN MATERIAL, CURABLE FILM, AND INSULATOR SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2004-01-02 EP disclosed