SCHEMBL4350889

SCHEMBL4350889

CC(C)n1ncc(Cl)c1O

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACLY P53396 1/20 0.34
DRD4 P21917 1/20 0.33
PIK3CD O00329 1/20 0.32
ABL1 P00519 1/20 0.32
EGFR P00533 1/20 0.32
HCK P08631 1/20 0.32
SRC P12931 1/20 0.32
KDR P35968 1/20 0.32
PIK3CA P42336 1/20 0.32
PIK3CB P42338 1/20 0.32
MTOR P42345 1/20 0.32
PIK3CG P48736 1/20 0.32
EPHB4 P54760 1/20 0.32
PRKDC P78527 1/20 0.32
PI4KB Q9UBF8 1/20 0.32
KDM4E B2RXH2 1/20 0.32
BPTF Q12830 1/20 0.31
CYP1A2 P05177 1/20 0.31
POLB P06746 1/20 0.31
CYP2C19 P33261 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4347184 0.77 DRD4 (0.35) ACLYDRD4KDM4EBPTFCYP1A2
SCHEMBL4360057 0.76 CYP1A2 (0.35) DRD4BPTFCYP1A2POLBCYP2C19
SCHEMBL23399096 0.76 DRD4 (0.35) DRD4KDM4EPDE9A
SCHEMBL28684793 0.74 DRD4 (0.33) DRD4BPTFCYP1A2POLBCYP2C19
SCHEMBL15077061 0.74 DRD4 (0.33) DRD4KDM4EBPTFCYP1A2POLB
SCHEMBL25594135 0.74 DRD4 (0.33) DRD4BPTFCYP1A2POLBCYP2C19
SCHEMBL23399163 0.74 KDM4E (0.35) KDM4ECYP1A2
SCHEMBL4359161 0.74 BPTF (0.34) DRD4ABL1SRCBPTFCYP1A2
SCHEMBL24484529 0.74 BPTF (0.32) DRD4BPTFKMOPDE9ANPBWR1
SCHEMBL1431085 0.72 KDM4E (0.41) KDM4ECYP1A2POLBKMO

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
CN-100496195-C Mulitilayer circuit board, resin base material, and its production method ZEON CORP (JP) 2009-06-03 CN disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
CN-100383278-C Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2008-04-23 CN disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
CN-1639384-A Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2005-07-13 CN disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed
CN-1552174-A Mulitilayer circuit board, resin base material, and its production method �ձ�������ʽ���� 2004-12-01 CN disclosed