SCHEMBL43524

SCHEMBL43524

CC(C(=O)O)=C(C1CCCC1)C1CCCC1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 1/20 0.42
CES1 P23141 1/20 0.42
HDAC8 Q9BY41 1/20 0.36
HDAC6 Q9UBN7 1/20 0.36
HSD11B1 P28845 2/20 0.35
GAA P10253 1/20 0.35
TSHR P16473 3/20 0.34
ALDH1A1 P00352 2/20 0.34
RECQL P46063 1/20 0.34
SMN1; SMN2 Q16637 2/20 0.33
HSD17B10 Q99714 1/20 0.33
LMNA P02545 3/20 0.32
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
SLC6A1 P30531 2/20 0.32
SLC6A11 P48066 1/20 0.32
SLC6A13 Q9NSD5 1/20 0.32
HPGD P15428 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31
HSD11B2 P80365 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2867269 0.98 CES2 (0.46) CES2CES1HDAC8HDAC6HSD11B1
SCHEMBL1043598 0.98 CES2 (0.46) CES2CES1HDAC8HDAC6HSD11B1
SCHEMBL2772945 0.98 CES2 (0.46) CES2CES1HDAC8HDAC6HSD11B1
SCHEMBL1155651 0.98 CES2 (0.46) CES2CES1HDAC8HDAC6HSD11B1
Methacrylic Acid SCHEMBL28555540 0.91 CES2 (0.36) CES2CES1HDAC8HDAC6HSD11B1
SCHEMBL3788611 0.80 CES2 (0.42) CES2CES1HDAC8HDAC6HSD11B1
SCHEMBL479553 0.80 CES2 (0.42) CES2CES1HDAC8HDAC6HSD11B1
SCHEMBL479710 0.78 CES2 (0.46) CES2CES1HDAC8HDAC6HSD11B1
SCHEMBL165071 0.78 CES2 (0.40) CES2CES1HDAC8HDAC6HSD11B1
SCHEMBL2000689 0.78 CES2 (0.46) CES2CES1HDAC8HDAC6HSD11B1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1345 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4476297-B1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION WITH IMPROVED CHEMICAL RESISTANCE TESA SE (DE) 2026-04-01 EP claimed
EP-4569056-B1 POLYALKYL (METH)ACRYLATE POLYMERS AS HIGH VISCOSITY BASE FLUIDS EVONIK OPERATIONS GMBH (DE) 2025-09-03 EP claimed
EP-3127955-B1 PRODUCTION METHOD FOR READILY DISPERSIBLE CELLULOSE COMPOSITION, READILY DISPERSIBLE CELLULOSE COMPOSITION, CELLULOSE DISPERSION RESIN COMPOSITION, AND PRODUCTION METHOD FOR WATER-BASED DISPERSANT FOR CELLULOSE DAINICHISEIKA COLOR CHEM (JP) 2024-11-27 EP claimed
CN-118625599-A Photosensitive resin composition, photosensitive dry film and preparation method thereof 杭州福斯特电子材料有限公司 2024-09-10 CN claimed
US-12012520-B2 Composition for encapsulating organic light emitting diodes and organic light emitting display device comprising the same SOLUS ADVANCED MATERIALS CO., LTD. (KR) 2024-06-18 US claimed
EP-4317198-A1 COMPOSITION FOR ORGANIC LIGHT-EMITTING ELEMENT ENCAPSULATION, AND ORGANIC LIGHT-EMITTING DISPLAY DEVICE COMPRISING SAME Solus Advanced Materials Co., Ltd. (KR) 2024-02-07 EP claimed
WO-2023195225-A1 FLUORINE-CONTAINING POLYMER AND FLUORINE-CONTAINING COMPOSITION ダイキン工業株式会社 2023-10-12 WO claimed
US-20230287221-A1 COMPOSITION FOR ENCAPSULATING ORGANIC LIGHT EMITTING DIODES AND ORGANIC LIGHT EMITTING DISPLAY DEVICE COMPRISING THE SAME SOLUS ADVANCED MATERIALS CO., LTD. (KR) 2023-09-14 US claimed
WO-2023152282-A1 PRESSURE-SENSITIVE ADHESIVE WITH IMPROVED CHEMICAL STABILITY TESA SE (DE) 2023-08-17 WO claimed
EP-3653677-B1 INK COMPOSITION FOR PHOTOCURABLE INKJET PRINTING SAKATA INX CORP (JP) 2023-01-11 EP claimed
US-20080220368-A1 PHOTOSENSITIVE PASTE COMPOSITION, BARRIER RIB PREPARED USING THE COMPOSITION AND PLASMA DISPLAY PANEL COMPRISING THE BARRIER RIB SAMSUNG SDI CO., LTD. (KR) 2008-09-11 US claimed
US-20080207807-A1 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION CHISSO CORPORATION (JP) 2008-08-28 US claimed
US-20080026320-A1 PHOTOSENSITIVE PASTE COMPOSITION, BARRIER RIB PREPARED USING THE COMPOSITION AND PLASMA DISPLAY PANEL COMPRISING THE BARRIER RIB SAMSUNG SDI CO., LTD. (KR) 2008-01-31 US claimed
EP-1870771-A2 Photosensitive paste composition, barrier rib prepared using the composition and plasma display panel comprising the barrier rib Samsung SDI Co., Ltd. (KR) 2007-12-26 EP claimed
US-7097959-B1 Negative resist composition ADMS TECHNOLOGY CO., LTD. (KR) 2006-08-29 US claimed
US-20050266341-A1 Photosensitive resin composition and LCD using the same LG CHEM, LTD. (PROSECUTION) (KR) 2005-12-01 US claimed
EP-0696621-B1 COATING COMPOSITION AND SURFACE-COATED MOLDING PRODUCED THEREWITH MITSUBISHI RAYON CO (JP) 2000-10-11 EP claimed
EP-0588534-B1 Radiation curing ink HAYAKAWA RUBBER (JP) 1998-12-02 EP claimed
EP-0588533-B1 Printed thermoplastic resin products and method for printing such products HAYAKAWA RUBBER (JP) 1998-08-12 EP claimed
EP-0593297-B1 Resin composition for coating and paint HITACHI CHEMICAL CO LTD (JP) 1997-04-16 EP claimed