SCHEMBL4352775

SCHEMBL4352775

C=C(C)C(=O)OCc1ccc(CO)c2ccccc12

nearest known ligand 0.40

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.37
CYP4F2 P78329 2/20 0.36
CYP4A11 Q02928 2/20 0.36
ELANE P08246 1/20 0.36
ALDH1A1 P00352 4/20 0.36
POLB P06746 1/20 0.35
APEX1 P27695 1/20 0.35
HTT P42858 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
THRB P10828 1/20 0.35
MAPT P10636 2/20 0.34
ACE2 Q9BYF1 2/20 0.33
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33
KDM4E B2RXH2 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
EPHX1 P07099 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4365395 0.94 TSHR (0.37) TSHRCYP4F2CYP4A11ELANEALDH1A1
SCHEMBL92352 0.88 IDO1 (0.39) TSHRELANEALDH1A1POLBHTT
SCHEMBL995952 0.87 CYP4F2 (0.45) TSHRCYP4F2CYP4A11ELANEALDH1A1
SCHEMBL12332755 0.85 KEAP1 (0.38) TSHRELANEALDH1A1TDP1THRB
SCHEMBL4365365 0.83 NCEH1 (0.36) TSHRALDH1A1MAPTMEN1KMT2A
SCHEMBL29577269 0.83 TSHR (0.44) TSHRELANEALDH1A1POLBAPEX1
SCHEMBL4202389 0.83 TSHR (0.44) TSHRELANEALDH1A1POLBAPEX1
SCHEMBL1130685 0.83 KMT2A (0.50) TDP1MEN1KMT2AL3MBTL1EPHX1
SCHEMBL92277 0.81 CYBB (0.38) TSHRPOLBAPEX1HTTTDP1
SCHEMBL14001881 0.81 CYP1A2 (0.39) TSHRALDH1A1POLBAPEX1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090266583-A1 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed