SCHEMBL4353040

SCHEMBL4353040

C=C(C)C(=O)Oc1cc(CO)cc(CO)c1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP4F2 P78329 2/20 0.53
CYP4A11 Q02928 2/20 0.53
ELANE P08246 1/20 0.44
KMT2A Q03164 2/20 0.41
ATM Q13315 1/20 0.41
DAO P14920 1/20 0.37
ALDH1A1 P00352 1/20 0.35
TSHR P16473 3/20 0.33
POLB P06746 1/20 0.33
APEX1 P27695 1/20 0.33
HTT P42858 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
MAPT P10636 2/20 0.33
PPARG P37231 1/20 0.32
PPARA Q07869 1/20 0.32
THRB P10828 1/20 0.32
ACHE P22303 1/20 0.31
PRKCA P17252 1/20 0.31
PRKCD Q05655 1/20 0.31
BACE1 P56817 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17829502 0.90 CYP4F2 (0.47) CYP4F2CYP4A11ELANEKMT2AATM
SCHEMBL4350998 0.83 ELANE (0.46) CYP4F2CYP4A11ELANEKMT2AATM
SCHEMBL18779819 0.82 ELANE (0.41) CYP4F2CYP4A11ELANEKMT2AATM
SCHEMBL10040692 0.82 ELANE (0.41) CYP4F2CYP4A11ELANEKMT2AATM
SCHEMBL15357797 0.82 ELANE (0.53) CYP4F2CYP4A11ELANEKMT2AATM
SCHEMBL4353041 0.81 ELANE (0.56) CYP4F2CYP4A11ELANEKMT2AATM
SCHEMBL21580266 0.80 ELANE (0.40) CYP4F2CYP4A11ELANEKMT2AATM
SCHEMBL10040732 0.79 ELANE (0.41) CYP4F2CYP4A11ELANEKMT2AATM
SCHEMBL17829501 0.79 ELANE (0.41) CYP4F2CYP4A11ELANEKMT2AATM
SCHEMBL1325036 0.78 ELANE (0.45) CYP4F2CYP4A11ELANEKMT2AATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090266583-A1 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed